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TMS320DM8165SCYG

Texas Instruments

TMS320DM8165SCYG by Texas Instruments

TMS320DM8165SCYG by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. Ideal for digital signal processing applications requiring low power mode and featuring multiple internal bus architecture.

Median Price

$72.506

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,769 parts In-Stock

1+ parts

$72.506

100+ parts

$70.326

1k+ parts

$54.516

10k+ parts

-

1,769

$72.506

$70.326

$54.516

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 154 parts In-Stock

1+ parts

$68.881

100+ parts

-

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-

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154

$68.881

-

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Vyrian

USA . 8,613 parts In-Stock

1+ parts

-

100+ parts

-

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8,613

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-

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A&K Electronics

USA . 1 parts In-Stock

1+ parts

-

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1

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Bristol Electronics

USA . 1 parts In-Stock

1+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 605 parts In-Stock

1+ parts

$16.193

100+ parts

-

1k+ parts

$16.512

10k+ parts

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605

$16.193

-

$16.512

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AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$17.010

100+ parts

-

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801

$17.010

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ChromeModa Solutions

Germany . 2,873 parts In-Stock

1+ parts

$18.194

100+ parts

$14.919

1k+ parts

-

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2,873

$18.194

$14.919

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$18.194

100+ parts

$17.284

1k+ parts

$16.375

10k+ parts

-

2,210

$18.194

$17.284

$16.375

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Ampacity Inc.

Singapore . 1,457 parts In-Stock

1+ parts

$61.630

100+ parts

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1,457

$61.630

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Corphita

USA . 3,506 parts In-Stock

1+ parts

$65.255

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3,506

$65.255

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Corohmni

South Africa . 315 parts In-Stock

1+ parts

$83.669

100+ parts

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315

$83.669

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Microchip USA

USA . 1,347 parts In-Stock

1+ parts

$131.790

100+ parts

$129.500

1k+ parts

$128.350

10k+ parts

$127.200

1,347

$131.790

$129.500

$128.350

$127.200

DigiPath Technology Company

USA . 928 parts In-Stock

1+ parts

-

100+ parts

$16.404

1k+ parts

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928

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$16.404

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Overview

Unlock unparalleled performance and efficiency with the TMS320DM8165SCYG by Texas Instruments, a leading manufacturer in the digital signal processors category. This powerful DSP offers integrated cache, boundary scan capabilities, and low power modes to optimize your applications. With a wide range of features and benefits, including fast data processing and high-speed connectivity, this product is a game-changer for industries such as automotive, telecommunications, and industrial automation. Trust Texas Instruments to deliver superior quality and reliability, enhancing your projects with cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Having an integrated cache improves the speed and efficiency of processing data, making the product suitable for high-performance applications.

Maximum Supply Voltage: 1.05 V

Operating within a moderate voltage range ensures optimal performance and stability of the product.

Address Bus Width: 15

A wider address bus allows for more memory addressing capabilities, enhancing the product's overall processing power.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy integration into various system designs.

Bit Size: 32

Having a 32-bit architecture enables the product to handle larger data sets and perform complex computations effectively.

No. of Terminals: 1031

With a high number of terminals, the product can support a wide range of input and output connections, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

This package style enhances thermal management and overall reliability of the product, ensuring long-term performance.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage allows for energy-efficient operation and extends the product's battery life.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the product suitable for a wide range of applications, including industrial and automotive environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides corrosion resistance and ensures reliable electrical connections, enhancing the product's longevity.

RAM Words: 16384

With a high RAM capacity, the product can store and process large amounts of data efficiently, improving overall performance.

Width: 25 mm

The compact width of the product enables easy integration into space-constrained designs, making it suitable for various applications.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging, simplifying the development and maintenance process for the product.

External Data Bus Width: 32

A wide external data bus width enhances data transfer speeds and overall system performance, making the product ideal for high-speed applications.

Peak Reflow Temperature °C: 245

With a high peak reflow temperature, the product can withstand the reflow soldering process during manufacturing without compromising its quality.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data flow and communication within the product, maximizing performance and speed.

Length: 25 mm

The compact length of the product enables flexible mounting options and compatibility with various system designs.

Temperature Grade: COMMERCIAL

Designed for commercial use, the product meets industry standards for reliability and performance in typical operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type provides versatility in connecting to various external devices, expanding the product's functionality and compatibility.

No. of Timers: 8

Having multiple timers allows for precise timing and control in applications that require synchronization and scheduling of tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures reliable solder connections and ease of installation, improving the product's overall durability and reliability.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V provides a balance between performance and power efficiency, making the product suitable for a wide range of applications.

No. of DMA Channels: 72

Having a high number of DMA channels allows for efficient data transfer and processing, enhancing system performance and responsiveness.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting and space-saving design options, making the product ideal for compact applications.

Format: FLOATING POINT

Supporting floating-point format allows for accurate representation and computation of decimal numbers, enhancing the product's precision in mathematical operations.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the product can withstand typical manufacturing and storage conditions without compromising its performance.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation and extends battery life in portable devices, making the product environmentally friendly and cost-effective.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8165SCYG attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8165SCYG Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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