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TMS320DM8148SCYE1

Texas Instruments

TMS320DM8148SCYE1 by Texas Instruments

TMS320DM8148SCYE1 by Texas Instruments is a 32-bit microprocessor with 8-word data RAM, 16-bit external data bus width, and 30 MHz clock frequency. It is used in applications requiring high-speed processing such as multimedia systems and industrial automation due to its low power mode feature.

Median Price

$65.862

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 306 parts In-Stock

1+ parts

$65.862

100+ parts

$58.544

1k+ parts

$43.047

10k+ parts

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306

$65.862

$58.544

$43.047

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,852 parts In-Stock

1+ parts

$62.569

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2,852

$62.569

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Vyrian

USA . 4,263 parts In-Stock

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4,263

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ComSIT Distribution GmbH

Germany . 749 parts In-Stock

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749

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Distributors (Availability)

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AZTECH Wire

Italy . 533 parts In-Stock

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$15.330

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533

$15.330

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Parana Technologies

USA . 271 parts In-Stock

1+ parts

$31.514

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$81.704

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271

$31.514

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$81.704

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DigiPath Technology Company

USA . 954 parts In-Stock

1+ parts

$34.701

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954

$34.701

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ChromeModa Solutions

Germany . 4,583 parts In-Stock

1+ parts

$35.409

100+ parts

$29.035

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4,583

$35.409

$29.035

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IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$35.409

100+ parts

$33.639

1k+ parts

$31.868

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822

$35.409

$33.639

$31.868

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Corphita

USA . 409 parts In-Stock

1+ parts

$59.276

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409

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Microchip USA

USA . 1,400 parts In-Stock

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$153.858

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1,400

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Component Stockers USA

USA . 88 parts In-Stock

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88

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Overview

Experience unparalleled performance and reliability with the TMS320DM8148SCYE1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line microprocessors that are versatile and efficient. This powerful device is perfect for a wide range of applications, offering customers exceptional value, benefits, and advantages. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TMS320DM8148SCYE1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides a durable and lightweight housing for the microprocessor, ensuring reliable performance.

Integrated Cache: YES

Having integrated cache helps improve the processing speed and efficiency of the microprocessor, making it a better choice for tasks that require quick data access.

Maximum Supply Voltage: 1.42 V

With a maximum supply voltage of 1.42V, this microprocessor offers stable power input, which is crucial for maintaining optimal performance and preventing damage from voltage spikes.

Address Bus Width: 28

A wider address bus width of 28 bits allows the microprocessor to access a larger memory capacity, enabling it to handle more complex tasks and data processing operations effectively.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures that the microprocessor remains stable and efficient even under demanding conditions, making it suitable for industrial and commercial applications.

Technical Specifications

Microprocessors TMS320DM8148SCYE1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.1/1.35

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8148SCYE1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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