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TMS320DM8127BCYE0

Texas Instruments

TMS320DM8127BCYE0 by Texas Instruments

TMS320DM8127BCYE0 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and max clock frequency of 30 MHz. Ideal for applications requiring low power mode, such as embedded systems in automotive electronics and industrial automation.

Median Price

$58.275

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$51.800

1k+ parts

$46.350

10k+ parts

$43.620

60

-

$51.800

$46.350

$43.620

DigiKey

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$64.750

1k+ parts

$57.938

10k+ parts

$54.525

60

-

$64.750

$57.938

$54.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,504 parts In-Stock

1+ parts

$54.672

100+ parts

-

1k+ parts

-

10k+ parts

-

2,504

$54.672

-

-

-

DigiKey Marketplace

USA . 60 parts In-Stock

1+ parts

$59.850

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$59.850

-

-

-

Vyrian

USA . 7,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,036

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,243 parts In-Stock

1+ parts

$16.793

100+ parts

-

1k+ parts

$17.039

10k+ parts

-

2,243

$16.793

-

$17.039

-

DigiPath Technology Company

USA . 296 parts In-Stock

1+ parts

$18.491

100+ parts

$17.011

1k+ parts

-

10k+ parts

-

296

$18.491

$17.011

-

-

ChromeModa Solutions

Germany . 5,964 parts In-Stock

1+ parts

$18.868

100+ parts

$15.472

1k+ parts

-

10k+ parts

-

5,964

$18.868

$15.472

-

-

IDEA Electronic Components Group

UK . 1,497 parts In-Stock

1+ parts

$18.868

100+ parts

$17.925

1k+ parts

$16.981

10k+ parts

-

1,497

$18.868

$17.925

$16.981

-

Corphita

USA . 330 parts In-Stock

1+ parts

$51.795

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$51.795

-

-

-

Microchip USA

USA . 324 parts In-Stock

1+ parts

$127.050

100+ parts

$124.840

1k+ parts

$123.740

10k+ parts

$122.630

324

$127.050

$124.840

$123.740

$122.630

Overview

Experience unparalleled performance and reliability with the TMS320DM8127BCYE0 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This high-quality product offers integrated cache, advanced surface mount capabilities, and a floating-point format, ensuring optimal functionality. With a maximum clock frequency of 30 MHz and low power mode, the TMS320DM8127BCYE0 provides unmatched value and benefits for customers seeking top-tier performance in their electronic devices. Elevate your projects to the next level with this exceptional microprocessor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, cost-effective, and durable, making the microprocessor easy to handle and install.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the microprocessor by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Surface mount technology makes it easy to mount the microprocessor onto circuit boards, saving space and reducing the overall footprint of the device.

Maximum Supply Voltage: 1.16 V

Operating within a maximum supply voltage of 1.16 V ensures the safety and stability of the microprocessor during operation.

Address Bus Width: 28

A wider address bus width of 28 bits allows the microprocessor to access a larger memory space, enabling it to handle more complex computational tasks.

Package Shape: SQUARE

The square package shape provides a symmetrical layout, making it easier to align and mount the microprocessor onto circuit boards.

Bit Size: 32

The 32-bit architecture of the microprocessor allows it to process larger chunks of data at a time, improving overall performance and efficiency.

No. of Terminals: 684

Having 684 terminals enables the microprocessor to interface with a wide range of external devices and peripherals, making it versatile and adaptable for different applications.

Minimum Supply Voltage: 1.05 V

Operating within a minimum supply voltage of 1.05 V ensures energy efficiency and helps in reducing power consumption of the microprocessor.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the microprocessor can handle higher temperature environments without compromising its performance and reliability.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures the microprocessor's functionality even in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of TIN SILVER COPPER terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the microprocessor.

Terminal Position: BOTTOM

Having terminals on the bottom allows for easier and more secure mounting of the microprocessor onto the circuit board, ensuring stable connections and reducing the risk of damage during handling.

Maximum Seated Height: 3.06 mm

The low seated height of 3.06 mm enables the microprocessor to fit into compact devices and tight spaces, making it suitable for applications with limited space constraints.

Width: 23 mm

The width of 23 mm provides a compact form factor for the microprocessor, making it suitable for small and portable devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and troubleshooting of the microprocessor, ensuring easier and faster maintenance and repair.

External Data Bus Width: 16

Having an external data bus width of 16 bits enables the microprocessor to transfer data to and from external devices at a faster rate, improving overall system performance.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz allows the microprocessor to execute instructions at a high speed, enhancing its overall processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can withstand soldering processes without being damaged, ensuring reliable solder connections.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the microprocessor can undergo solder reflow processes without exceeding its thermal limits, ensuring proper soldering and assembly.

Length: 23 mm

The length of 23 mm contributes to the compact size and form factor of the microprocessor, making it suitable for applications where space is limited.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for efficient and fast execution of instructions, making it ideal for applications requiring high-speed processing.

Technology: CMOS

The CMOS (Complementary Metal-Oxide-Semiconductor) technology used in the microprocessor offers low power consumption, high noise immunity, and high speed, making it an energy-efficient and reliable choice.

Terminal Form: BALL

Having ball terminals provides a reliable and secure connection for the microprocessor, ensuring stable electrical contacts and reducing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1.1 V

Operating at a nominal supply voltage of 1.1 V ensures stable and reliable performance of the microprocessor, balancing power consumption and processing speed effectively.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the microprocessor offers fine pitch connections that are suitable for high-density circuit boards, allowing for more compact and efficient designs.

Format: FLOATING POINT

Supporting floating-point operations enhances the microprocessor's ability to perform complex mathematical calculations with decimal points accurately and efficiently.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring its reliability and longevity.

Speed: 600 rpm

Operating at a speed of 600 rpm allows for rapid data processing and execution of tasks, making the microprocessor suitable for applications requiring high-speed performance.

Low Power Mode: YES

The low power mode feature allows the microprocessor to reduce its power consumption during idle or low-demand periods, enhancing energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Microprocessors TMS320DM8127BCYE0 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.06 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127BCYE0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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