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TMS320C5533AZHHA05

Texas Instruments

TMS320C5533AZHHA05 by Texas Instruments

TMS320C5533AZHHA05 by Texas Instruments is a 16-bit DSP with 65536 RAM words, 12 MHz clock frequency, and 1.15V max supply voltage. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode capability.

Median Price

$3.775

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$3.020

1k+ parts

$2.700

10k+ parts

$2.540

260

-

$3.020

$2.700

$2.540

DigiKey

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$3.980

1k+ parts

-

10k+ parts

-

260

-

$3.980

-

-

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$3.775

1k+ parts

$3.375

10k+ parts

$3.175

260

-

$3.775

$3.375

$3.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,641 parts In-Stock

1+ parts

$3.182

100+ parts

-

1k+ parts

-

10k+ parts

-

2,641

$3.182

-

-

-

Vyrian

USA . 7,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,710

-

-

-

-

DigiKey Marketplace

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

260

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 190 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$2.850

-

-

-

Corphita

USA . 113 parts In-Stock

1+ parts

$3.015

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$3.015

-

-

-

Component Stockers USA

USA . 171 parts In-Stock

1+ parts

$3.410

100+ parts

$3.210

1k+ parts

-

10k+ parts

-

171

$3.410

$3.210

-

-

Parana Technologies

USA . 640 parts In-Stock

1+ parts

$15.300

100+ parts

-

1k+ parts

$15.693

10k+ parts

-

640

$15.300

-

$15.693

-

ChromeModa Solutions

Germany . 4,381 parts In-Stock

1+ parts

$17.191

100+ parts

$14.097

1k+ parts

-

10k+ parts

-

4,381

$17.191

$14.097

-

-

IDEA Electronic Components Group

UK . 1,677 parts In-Stock

1+ parts

$17.191

100+ parts

$16.331

1k+ parts

$15.472

10k+ parts

-

1,677

$17.191

$16.331

$15.472

-

Microchip USA

USA . 497 parts In-Stock

1+ parts

$22.620

100+ parts

$22.480

1k+ parts

$22.410

10k+ parts

$22.340

497

$22.620

$22.480

$22.410

$22.340

Corohmni

South Africa . 1,864 parts In-Stock

1+ parts

$25.782

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$25.782

-

-

-

Kepictronics

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,200

-

-

-

-

DigiPath Technology Company

USA . 1,052 parts In-Stock

1+ parts

-

100+ parts

$15.499

1k+ parts

-

10k+ parts

-

1,052

-

$15.499

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320C5533AZHHA05 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. This versatile DSP is perfect for a wide range of applications, offering exceptional value and performance. With its low power mode and multiple on-chip features, this product provides customers with the advantages they need to stay ahead in today's fast-paced world. Experience superior processing capabilities with the TMS320C5533AZHHA05 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

Being surface mountable means easier and more efficient PCB assembly, saving time and labor costs during manufacturing.

Maximum Supply Voltage: 1.15 V

Operating at a maximum supply voltage of 1.15 V ensures power efficiency and helps in reducing heat dissipation, making the product energy-efficient.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 allows for faster data processing and storage capabilities, improving overall system performance.

Package Shape: SQUARE

The square package shape provides efficient use of board space and easier integration into electronic devices.

Bit Size: 16

Operating with a 16-bit architecture provides higher precision and accuracy in signal processing applications, making the product ideal for digital signal processing tasks.

Power Supplies (V): 1.05,1.8/3.3

Supporting multiple power supply voltages (1.05, 1.8, 3.3 V) allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 144

Having a high number of terminals (144) enables the product to interface with various external components and peripherals, enhancing connectivity options.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density mounting, increasing integration capabilities and reducing overall PCB footprint.

Minimum Supply Voltage: 0.998 V

Operational at a minimum supply voltage of 0.998 V ensures reliable performance even in low-power conditions, making the product versatile in different power environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable operation in harsh conditions.

No. of External Interrupts: 2

Featuring 2 external interrupts allows the product to respond quickly to external events or signals, improving real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures functionality in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of tin-silver-copper terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier PCB assembly and better thermal management, enhancing overall system reliability.

Maximum Seated Height: 1.4 mm

With a maximum seated height of 1.4 mm, the product offers a compact form factor, enabling space-saving designs in tight applications.

RAM Words: 65536

Featuring a high number of RAM words (65536) allows for large data storage capacity and efficient data processing, enhancing the product's performance in demanding applications.

Width: 12 mm

With a width of 12 mm, the product is compact and space-efficient, making it suitable for applications where board space is limited.

Boundary Scan: YES

Incorporating boundary scan technology allows for easier testing and debugging of the product during manufacturing, improving overall quality control.

Maximum Clock Frequency: 12 MHz

Operating at a maximum clock frequency of 12 MHz enables fast and efficient data processing, making the product ideal for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures proper reflow soldering during manufacturing, leading to reliable solder joints.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective solder reflow, ensuring strong and durable connections during assembly.

Internal Bus Architecture: MULTIPLE

Featuring multiple internal bus architecture improves data transfer speeds and allows for efficient communication between different components, enhancing overall system performance.

Length: 12 mm

With a length of 12 mm, the product offers a compact form factor, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, the product can withstand harsh operating conditions, making it reliable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral ICs enhances the product's capabilities for signal processing tasks, making it versatile for various application requirements.

No. of Timers: 4

Featuring 4 timers provides additional timing functionalities, allowing for precise time measurements and synchronization in signal processing applications.

Technology: CMOS

Operating on CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Having ball terminal form ensures reliable connections and easy soldering during PCB assembly, improving overall manufacturing efficiency and product reliability.

Nominal Supply Voltage: 1.05 V

Operating at a nominal supply voltage of 1.05 V provides stable power delivery, ensuring consistent performance and reliability in various operating conditions.

No. of DMA Channels: 16

Featuring 16 DMA channels allows for efficient data transfer between peripherals and memory, reducing CPU overhead and improving overall system performance.

ROM Programmability: MROM

Having MROM programmability enables secure and permanent storage of firmware or configuration data, ensuring data integrity and reliability in the product's operation.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the product offers high-density mounting capabilities, enabling compact designs and efficient use of board space.

Format: FIXED POINT

Operating on a fixed-point format allows for faster and more efficient arithmetic calculations, making the product ideal for real-time signal processing tasks that require precision.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the product has moderate moisture sensitivity, requiring standard handling and storage practices to prevent damage during assembly and operation.

Low Power Mode: YES

Supporting a low power mode enhances energy efficiency and extends battery life in portable devices, making the product suitable for power-sensitive applications.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, the product can store and execute program instructions efficiently, improving overall system performance and responsiveness.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5533AZHHA05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05,1.8/3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5533AZHHA05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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