Loading...

TLV840MAPL36DBVRQ1

Texas Instruments

TLV840MAPL36DBVRQ1 by Texas Instruments

TLV840MAPL36DBVRQ1 by Texas Instruments is a Power Management IC with 5 terminals, operating from -40 to 125 °C. It has a nominal voltage of 0.9 V and threshold voltage of +3.6V, suitable for automotive applications due to AEC-Q100 screening level.

Median Price

$0.689

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,397 parts In-Stock

1+ parts

$0.548

100+ parts

$0.422

1k+ parts

$0.222

10k+ parts

-

16,397

$0.548

$0.422

$0.222

-

Mouser Electronics

USA . 3,548 parts In-Stock

1+ parts

$0.830

100+ parts

$0.693

1k+ parts

$0.473

10k+ parts

$0.355

3,548

$0.830

$0.693

$0.473

$0.355

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.345

-

-

-

Digiode

USA . 830 parts In-Stock

1+ parts

$0.521

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$0.521

-

-

-

Vyrian

USA . 10,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,135

-

-

-

-

Chip Stock

USA . 7,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,270

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,775 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

$0.339

4,775

$0.345

-

-

$0.339

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

$0.328

10k+ parts

$0.321

2,000

$0.345

-

$0.328

$0.321

Argo Parts USA

USA . 1,255 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

$0.335

1,255

$0.345

-

-

$0.335

Ampacity Inc.

Singapore . 10,077 parts In-Stock

1+ parts

$0.466

100+ parts

-

1k+ parts

-

10k+ parts

-

10,077

$0.466

-

-

-

Corphita

USA . 3,672 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

-

3,672

$0.493

-

-

-

Corohmni

South Africa . 339 parts In-Stock

1+ parts

$1.484

100+ parts

-

1k+ parts

-

10k+ parts

-

339

$1.484

-

-

-

Parana Technologies

USA . 1,273 parts In-Stock

1+ parts

$15.027

100+ parts

-

1k+ parts

$15.440

10k+ parts

-

1,273

$15.027

-

$15.440

-

DigiPath Technology Company

USA . 67 parts In-Stock

1+ parts

$16.546

100+ parts

$15.223

1k+ parts

-

10k+ parts

-

67

$16.546

$15.223

-

-

ChromeModa Solutions

Germany . 6,664 parts In-Stock

1+ parts

$16.884

100+ parts

$13.845

1k+ parts

-

10k+ parts

-

6,664

$16.884

$13.845

-

-

IDEA Electronic Components Group

UK . 625 parts In-Stock

1+ parts

$16.884

100+ parts

$16.040

1k+ parts

$15.196

10k+ parts

-

625

$16.884

$16.040

$15.196

-

Lixinc

USA . 3,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,687

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the TLV840MAPL36DBVRQ1 Power Management IC. Designed for automotive applications, this small outline, low profile IC offers a wide supply voltage range and dual terminal position for optimal performance. With a robust package body material and advanced screening level, customers can trust in the durability and efficiency of this power supply support circuit. Trust Texas Instruments to deliver cutting-edge technology that meets your power management needs with precision and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the internal components of the Power Management IC.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards.

Screening Level: AEC-Q100

AEC-Q100 certification ensures the quality, reliability, and durability of the Power Management IC for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 0.9 V

Low nominal supply voltage helps in reducing power consumption.

No. of Terminals: 5

Having a small number of terminals simplifies the integration of the IC into the overall system.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Small outline, low profile, and shrink pitch package style helps in minimizing the overall size of the IC and enhances space efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and usage.

Maximum Seated Height: 1.45 mm

Low seated height helps in reducing the overall profile of the IC on the circuit board.

Width (mm): 1.6 mm

Small width allows for compact placement of the IC on the circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC helps in regulating and managing power efficiently.

Minimum Supply Voltage (Vsup): 0.7 V

Low minimum supply voltage allows for operation in low power scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and bonding of the IC during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables secure solder joints for robust connections.

Length: 2.9 mm

Short length contributes to the compact size and space efficiency of this IC.

Nominal Threshold Voltage (V): +3.6V

Nominal threshold voltage setting allows for precise and stable operation of the IC.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures the IC can endure the temperature fluctuations commonly encountered in automotive environments.

Maximum Supply Current (Isup): 0.0012 mA

Low maximum supply current helps in minimizing power consumption.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting onto the circuit board.

Terminal Pitch: 0.95 mm

Narrow terminal pitch aids in compact placement and space-saving on the circuit board.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage provides compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs TLV840MAPL36DBVRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

.7 V

Nominal Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.6V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TLV840MAPL36DBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19