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TLV803EA26RDBZR

Texas Instruments

TLV803EA26RDBZR by Texas Instruments

TLV803EA26RDBZR by Texas Instruments is a 3-terminal Power Management IC with a nominal voltage of 3.3V, suitable for automotive applications. It has a small outline package style, matte tin terminal finish, and operates b/w -40 to 125°C temperature range.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 312,279 parts In-Stock

1+ parts

$0.313

100+ parts

$0.213

1k+ parts

$0.109

10k+ parts

-

312,279

$0.313

$0.213

$0.109

-

DigiKey

USA . 7,165 parts In-Stock

1+ parts

$0.430

100+ parts

$0.231

1k+ parts

$0.196

10k+ parts

$0.177

7,165

$0.430

$0.231

$0.196

$0.177

Mouser Electronics

USA . 4,698 parts In-Stock

1+ parts

$0.430

100+ parts

$0.231

1k+ parts

$0.196

10k+ parts

$0.177

4,698

$0.430

$0.231

$0.196

$0.177

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$0.235

-

-

-

Digiode

USA . 482 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$0.297

-

-

-

Maritex

Poland . 6,209 parts In-Stock

1+ parts

$0.356

100+ parts

$0.251

1k+ parts

$0.196

10k+ parts

-

6,209

$0.356

$0.251

$0.196

-

Vyrian

USA . 108,589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108,589

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,645 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

$0.228

4,645

$0.235

-

-

$0.228

Continental Prestige Electronics

USA . 4,272 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

$0.230

4,272

$0.235

-

-

$0.230

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

$0.223

10k+ parts

$0.219

1,000

$0.235

-

$0.223

$0.219

Ampacity Inc.

Singapore . 108,603 parts In-Stock

1+ parts

$0.266

100+ parts

-

1k+ parts

-

10k+ parts

-

108,603

$0.266

-

-

-

Semicontronic

India . 108,565 parts In-Stock

1+ parts

$0.266

100+ parts

$0.259

1k+ parts

$0.258

10k+ parts

-

108,565

$0.266

$0.259

$0.258

-

Corphita

USA . 4,171 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

-

4,171

$0.282

-

-

-

Parana Technologies

USA . 1,104 parts In-Stock

1+ parts

$17.208

100+ parts

-

1k+ parts

$17.423

10k+ parts

-

1,104

$17.208

-

$17.423

-

DigiPath Technology Company

USA . 804 parts In-Stock

1+ parts

$18.948

100+ parts

-

1k+ parts

-

10k+ parts

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804

$18.948

-

-

-

ChromeModa Solutions

Germany . 5,614 parts In-Stock

1+ parts

$19.335

100+ parts

$15.855

1k+ parts

-

10k+ parts

-

5,614

$19.335

$15.855

-

-

IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$19.335

100+ parts

$18.368

1k+ parts

$17.402

10k+ parts

-

1,764

$19.335

$18.368

$17.402

-

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$24.746

100+ parts

-

1k+ parts

-

10k+ parts

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174

$24.746

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,652 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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24,652

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Overview

Texas Instruments, a renowned leader in the industry, presents the TLV803EA26RDBZR Power Management IC. Designed with precision and reliability, this product offers unparalleled quality and performance. Ideal for automotive applications, this IC ensures stable power supply support circuitry, enhancing overall system efficiency. Experience the value and benefits of Texas Instruments' expertise with the TLV803EA26RDBZR, delivering optimal performance and peace of mind to customers seeking top-notch power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers durability and protection for the IC, making it a reliable choice.

Surface Mount: YES

With surface mount capability, the IC can be easily integrated into PCBs, enhancing ease of assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at 3.3 V allows for compatibility with a wide range of electronic devices, making it versatile.

No. of Terminals: 3

The compact size with 3 terminals makes it ideal for simple power management applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design save space on the PCB, making it suitable for slim devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the IC can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures allows for use in diverse applications, enhancing versatility.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance, ensuring long-term reliability of the IC.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connection options, making it convenient for designers.

Maximum Seated Height: 1.12 mm

The low seated height enables the IC to be used in slim devices without compromising on performance.

Width (mm): 1.3 mm

The compact width of 1.3 mm allows for space-efficient integration on the PCB, ideal for miniaturized designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC type specifically designed for power supply support provides efficient power management solutions.

Minimum Supply Voltage (Vsup): 1.7 V

Operating at a minimum voltage of 1.7 V offers flexibility in power supply options, enhancing compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the IC can be easily integrated into manufacturing processes, ensuring efficient production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable soldering during assembly, maintaining product quality.

Length: 2.92 mm

The length of 2.92 mm suits compact designs, offering space-saving benefits in electronic applications.

Nominal Threshold Voltage (V): 2.64

The nominal threshold voltage of 2.64 V ensures precise voltage regulation, contributing to stable power supply management.

Temperature Grade: AUTOMOTIVE

With automotive temperature grade, the IC is suitable for use in automotive applications, ensuring reliability in harsh conditions.

Maximum Supply Current (Isup): 0.0012 mA

Operating at a maximum supply current of 0.0012 mA minimizes power consumption, making it energy-efficient.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connection points, enhancing durability and reliability.

Terminal Pitch: 0.95 mm

The compact terminal pitch of 0.95 mm offers fine-pitch connectivity, suitable for high-density PCB designs.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6 V, the IC offers a wide input voltage range, making it versatile for various power supply applications.

Technical Specifications

Power Management ICs TLV803EA26RDBZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.64

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

TLV803EA26RDBZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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