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TLV803EF29DBZR

Texas Instruments

TLV803EF29DBZR by Texas Instruments

TLV803EF29DBZR by Texas Instruments is a 3-terminal power management IC with a nominal voltage of 3.3V and threshold voltage of 2.93V, suitable for automotive applications. It has a small outline package style, matte tin terminal finish, and operates in temperatures ranging from -40 to 125°C.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 598,026 parts In-Stock

1+ parts

$0.313

100+ parts

$0.213

1k+ parts

$0.109

10k+ parts

-

598,026

$0.313

$0.213

$0.109

-

Mouser Electronics

USA . 27,210 parts In-Stock

1+ parts

$0.430

100+ parts

$0.232

1k+ parts

$0.196

10k+ parts

$0.174

27,210

$0.430

$0.232

$0.196

$0.174

DigiKey

USA . 7,591 parts In-Stock

1+ parts

$0.430

100+ parts

$0.231

1k+ parts

$0.196

10k+ parts

$0.177

7,591

$0.430

$0.231

$0.196

$0.177

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.196

-

-

-

Digiode

USA . 4,464 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

-

4,464

$0.297

-

-

-

Vyrian

USA . 219,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

219,723

-

-

-

-

Chip Stock

USA . 47,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

47,676

-

-

-

-

Bristol Electronics

USA . 6,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,859

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,742 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

$0.192

4,742

$0.196

-

-

$0.192

Argo Parts USA

USA . 1,479 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

$0.191

1,479

$0.196

-

-

$0.191

Ampacity Inc.

Singapore . 219,292 parts In-Stock

1+ parts

$0.266

100+ parts

-

1k+ parts

-

10k+ parts

-

219,292

$0.266

-

-

-

Corphita

USA . 1,799 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,799

$0.282

-

-

-

Corohmni

South Africa . 37 parts In-Stock

1+ parts

$1.280

100+ parts

-

1k+ parts

-

10k+ parts

-

37

$1.280

-

-

-

Parana Technologies

USA . 1,814 parts In-Stock

1+ parts

$15.929

100+ parts

-

1k+ parts

$16.285

10k+ parts

-

1,814

$15.929

-

$16.285

-

ChromeModa Solutions

Germany . 5,475 parts In-Stock

1+ parts

$17.898

100+ parts

$14.676

1k+ parts

-

10k+ parts

-

5,475

$17.898

$14.676

-

-

IDEA Electronic Components Group

UK . 508 parts In-Stock

1+ parts

$17.898

100+ parts

$17.003

1k+ parts

$16.108

10k+ parts

-

508

$17.898

$17.003

$16.108

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,121

-

-

-

-

Lixinc

USA . 2,764 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,764

-

-

-

-

DigiPath Technology Company

USA . 470 parts In-Stock

1+ parts

-

100+ parts

$16.137

1k+ parts

-

10k+ parts

-

470

-

$16.137

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.192

1k+ parts

$0.187

10k+ parts

$0.183

100

-

$0.192

$0.187

$0.183

Overview

Experience unparalleled quality and reliability with the TLV803EF29DBZR by Texas Instruments, a leading manufacturer in the Power Management ICs category. This innovative product offers customers a compact package, high performance, and wide operating temperature range, making it ideal for automotive applications and power supply support circuits. Trust Texas Instruments to deliver exceptional value and benefits with the TLV803EF29DBZR, providing peace of mind and superior functionality for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, making it suitable for various applications and environments.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with standard voltage requirements in many electronic devices, ensuring compatibility.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments, offering reliability in harsh conditions.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature applications without risk of overheating or performance degradation.

Terminal Finish: MATTE TIN

Provides a reliable and consistent connection for optimal performance and longevity.

Terminal Position: DUAL

Allows for versatile and flexible PCB layout options, accommodating different design requirements.

Width (mm): 1.3 mm

Compact size saves space on the PCB, ideal for applications with limited board real estate.

Minimum Supply Voltage (Vsup): 1.7 V

Can operate at low voltages, making it energy-efficient and suitable for battery-powered devices.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature performance and reliability, making it suitable for automotive applications.

Maximum Supply Current (Isup): 0.0012 mA

Low power consumption for efficiency and reduced energy costs in operation.

Terminal Pitch: 0.95 mm

Fine pitch spacing allows for high-density PCB designs, maximizing functionality in compact devices.

Maximum Supply Voltage (Vsup): 6 V

Can handle higher voltages for versatility in applications that require a wider voltage range.

Technical Specifications

Power Management ICs TLV803EF29DBZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.93

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

TLV803EF29DBZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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