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TLV809L30DBVR

Texas Instruments

TLV809L30DBVR by Texas Instruments

TLV809L30DBVR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features a small outline package style, dual terminal position, and low profile design. With a wide operating temperature range of -40 to 85°C, it offers reliable power supply support in compact electronic devices.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,453 parts In-Stock

1+ parts

$0.344

100+ parts

$0.234

1k+ parts

$0.120

10k+ parts

-

8,453

$0.344

$0.234

$0.120

-

Mouser Electronics

USA . 4,875 parts In-Stock

1+ parts

$0.540

100+ parts

$0.294

1k+ parts

$0.250

10k+ parts

$0.216

4,875

$0.540

$0.294

$0.250

$0.216

Rochester

USA . 136,561 parts In-Stock

1+ parts

-

100+ parts

$0.236

1k+ parts

$0.196

10k+ parts

$0.175

136,561

-

$0.236

$0.196

$0.175

DigiKey

USA . 136,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.300

136,561

-

-

-

$0.300

Verical

USA . 136,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.218

136,561

-

-

-

$0.218

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,878 parts In-Stock

1+ parts

$0.159

100+ parts

-

1k+ parts

-

10k+ parts

-

3,878

$0.159

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.255

-

-

-

Vyrian

USA . 90,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90,154

-

-

-

-

Chip Stock

USA . 38,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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38,100

-

-

-

-

Cyclops Electronics Ltd

UK . 3,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,079

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 89,954 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

-

10k+ parts

-

89,954

$0.142

-

-

-

Corphita

USA . 4,498 parts In-Stock

1+ parts

$0.150

100+ parts

-

1k+ parts

-

10k+ parts

-

4,498

$0.150

-

-

-

Argo Parts USA

USA . 3,717 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

$0.247

3,717

$0.255

-

-

$0.247

Continental Prestige Electronics

USA . 2,955 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

$0.250

2,955

$0.255

-

-

$0.250

Parana Technologies

USA . 1,622 parts In-Stock

1+ parts

$2.927

100+ parts

-

1k+ parts

$3.427

10k+ parts

-

1,622

$2.927

-

$3.427

-

DigiPath Technology Company

USA . 2,132 parts In-Stock

1+ parts

$3.223

100+ parts

$2.965

1k+ parts

-

10k+ parts

-

2,132

$3.223

$2.965

-

-

ChromeModa Solutions

Germany . 3,923 parts In-Stock

1+ parts

$3.289

100+ parts

$2.697

1k+ parts

-

10k+ parts

-

3,923

$3.289

$2.697

-

-

IDEA Electronic Components Group

UK . 874 parts In-Stock

1+ parts

$3.289

100+ parts

-

1k+ parts

$2.960

10k+ parts

-

874

$3.289

-

$2.960

-

Lixinc

USA . 13,837 parts In-Stock

1+ parts

-

100+ parts

-

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13,837

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-

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A-Z Elektronik GmbH

Germany . 8,036 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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8,036

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-

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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6,000

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-

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Perfect Parts

USA . 3,147 parts In-Stock

1+ parts

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3,147

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-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.250

1k+ parts

$0.242

10k+ parts

$0.237

1,000

-

$0.250

$0.242

$0.237

iodParts Technologies Inc.

India . 784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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784

-

-

-

-

Overview

Discover the efficient and reliable TLV809L30DBVR from Texas Instruments, a leading manufacturer in Power Management ICs. This small outline, low profile package offers a nominal supply voltage of 3.3V and a range of applications in power supply support circuits. With a wide operating temperature range and high-quality materials, this IC provides customers with a valuable solution for their power management needs. Trust Texas Instruments for superior performance and innovative technology that delivers exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the Power Management IC.

Surface Mount: YES

The surface mount feature allows for easy installation and space saving on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is common in many electronic systems, making this IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides excellent conductivity and corrosion resistance for reliable performance.

Width (mm): 1.6 mm

The small width of 1.6mm allows for compact and efficient designs in electronic circuits.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement of 2V allows for use in low-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions.

Maximum Supply Current (Isup): 0.025 mA

The low maximum supply current of 0.025mA helps in reducing power consumption in the system.

Technical Specifications

Power Management ICs TLV809L30DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.64V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TLV809L30DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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