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TLV803MDBZR

Texas Instruments

TLV803MDBZR by Texas Instruments

TLV803MDBZR by Texas Instruments is a Power Management IC with 3 terminals, operating b/w -40 to 125°C. It has a supply voltage range of 1.1-6V and peak reflow temp of 260°C. Ideal for automotive applications due to its small size and low supply current requirements.

Median Price

$0.394

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 69 parts In-Stock

1+ parts

$0.394

100+ parts

$0.284

1k+ parts

-

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69

$0.394

$0.284

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Texas Instruments

USA . 364,654 parts In-Stock

1+ parts

$0.514

100+ parts

$0.349

1k+ parts

$0.179

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364,654

$0.514

$0.349

$0.179

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Mouser Electronics

USA . 961 parts In-Stock

1+ parts

$0.650

100+ parts

$0.362

1k+ parts

$0.337

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961

$0.650

$0.362

$0.337

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Chip1Stop

Japan . 595 parts In-Stock

1+ parts

-

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$0.309

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$0.230

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595

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$0.309

$0.230

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Verical

USA . 69 parts In-Stock

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$0.284

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69

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$0.284

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Distributors (In-Stock)

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Digiode

USA . 2,667 parts In-Stock

1+ parts

$0.370

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2,667

$0.370

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Vyrian

USA . 64,030 parts In-Stock

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64,030

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ComSIT Distribution GmbH

Germany . 4,118 parts In-Stock

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4,118

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Elcom Components

USA . 131 parts In-Stock

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131

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semtec, LLC

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Ampacity Inc.

Singapore . 64,021 parts In-Stock

1+ parts

$0.196

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64,021

$0.196

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Semicontronic

India . 63,976 parts In-Stock

1+ parts

$0.196

100+ parts

$0.191

1k+ parts

$0.190

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63,976

$0.196

$0.191

$0.190

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Corphita

USA . 3,646 parts In-Stock

1+ parts

$0.351

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3,646

$0.351

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Parana Technologies

USA . 480 parts In-Stock

1+ parts

$8.580

100+ parts

-

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$9.241

10k+ parts

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480

$8.580

-

$9.241

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DigiPath Technology Company

USA . 691 parts In-Stock

1+ parts

$9.448

100+ parts

-

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691

$9.448

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ChromeModa Solutions

Germany . 3,354 parts In-Stock

1+ parts

$9.641

100+ parts

$7.906

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3,354

$9.641

$7.906

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IDEA Electronic Components Group

UK . 240 parts In-Stock

1+ parts

$9.641

100+ parts

$9.159

1k+ parts

$8.677

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240

$9.641

$9.159

$8.677

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Corohmni

South Africa . 1,174 parts In-Stock

1+ parts

$15.495

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1,174

$15.495

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Lixinc

USA . 18,097 parts In-Stock

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Perfect Parts

USA . 14,647 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,099 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,118 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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S.R.D Solutions

India . 2,800 parts In-Stock

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Argo Parts USA

USA . 2,285 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,382 parts In-Stock

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iodParts Technologies Inc.

India . 1,374 parts In-Stock

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1,374

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Speed Components Ltd (Excess)

Israel . 123 parts In-Stock

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123

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the cutting-edge TLV803MDBZR by Texas Instruments, a top-tier Power Management IC that guarantees unparalleled quality and reliability. With a focus on automotive applications, this sleek and compact device offers a wide supply voltage range and low supply current, ensuring optimal performance in any situation. Trust in Texas Instruments' renowned expertise to deliver a superior product that exceeds expectations, providing unmatched value and peace of mind for all your power management needs. Choose the TLV803MDBZR for exceptional results every time.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the internal components of the IC, making it suitable for various environments.

Surface Mount

YES - This feature allows for easy installation and space-saving benefits on the circuit board.

Package Shape

RECTANGULAR - The rectangular shape makes it easy to position and secure the IC on the board during assembly.

Nominal Supply Voltage (Vsup)

2 V - The 2 V supply voltage ensures stable and efficient performance of the IC within the specified range.

Power Supplies (V)

1.1/6 - This wide range of power supplies allows for versatility and compatibility with different systems.

No. of Terminals

3 - The 3 terminals provide necessary connections for power and data transmission.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This style offers a compact design that is ideal for space-constrained applications.

Maximum Operating Temperature

125 °C - With a high maximum operating temperature, this IC can withstand harsh conditions and maintain reliability.

Minimum Operating Temperature

40 °C - The low minimum operating temperature ensures functionality even in cold environments.

Terminal Finish

Matte Tin (Sn) - The matte tin finish provides corrosion resistance and promotes good solderability for reliable connections.

Terminal Position

DUAL - Dual terminal positions offer flexibility in mounting options for the IC on the circuit board.

Maximum Seated Height

1.12 mm - The low seated height contributes to a streamlined and compact design overall.

Width (mm)

1.3 mm - The narrow width makes this IC suitable for applications with limited board space.

Other IC Type

POWER SUPPLY SUPPORT CIRCUIT - This IC is designed specifically to support power supply functions, ensuring efficiency and reliability.

Minimum Supply Voltage (Vsup)

1.1 V - The 1.1 V minimum supply voltage allows for operation in low-power applications or energy-efficient systems.

Peak Reflow Temperature °C

260 - The high peak reflow temperature ensures secure solder joints during assembly processes.

Length

2.92 mm - The compact length of the IC facilitates easy placement on the circuit board.

Nominal Threshold Voltage (V)

+4.38V - The nominal threshold voltage ensures proper operation within the specified voltage range.

Temperature Grade

AUTOMOTIVE - This IC is designed to meet automotive industry standards for temperature and reliability.

Maximum Supply Current (Isup)

0.025 mA - The low supply current consumption makes this IC suitable for power-efficient applications.

Terminal Form

GULL WING - The gull wing terminal form provides mechanical stability and ease of solderability during assembly.

Terminal Pitch

0.95 mm - The narrow terminal pitch allows for high-density mounting on the circuit board.

Maximum Supply Voltage (Vsup)

6 V - The 6 V maximum supply voltage offers flexibility in powering the IC within safe operating limits.

Technical Specifications

Power Management ICs TLV803MDBZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/6

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.3 mm

Trade Compliance

TLV803MDBZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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