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TLV840MADL32DBVRQ1

Texas Instruments

TLV840MADL32DBVRQ1 by Texas Instruments

TLV840MADL32DBVRQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening. It operates at -40 to 125 °C, supporting supply voltages from 0.7V to 6V. Ideal for automotive applications due to its compact size and low power consumption of 0.0012 mA.

Median Price

$0.689

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,020 parts In-Stock

1+ parts

$0.548

100+ parts

$0.422

1k+ parts

$0.222

10k+ parts

-

26,020

$0.548

$0.422

$0.222

-

Mouser Electronics

USA . 10,445 parts In-Stock

1+ parts

$0.830

100+ parts

$0.693

1k+ parts

$0.473

10k+ parts

$0.357

10,445

$0.830

$0.693

$0.473

$0.357

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$0.345

-

-

-

Digiode

USA . 357 parts In-Stock

1+ parts

$0.521

100+ parts

-

1k+ parts

-

10k+ parts

-

357

$0.521

-

-

-

Vyrian

USA . 18,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,616

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 18,465 parts In-Stock

1+ parts

$0.238

100+ parts

$0.232

1k+ parts

$0.231

10k+ parts

-

18,465

$0.238

$0.232

$0.231

-

Ampacity Inc.

Singapore . 18,457 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

-

18,457

$0.238

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.339

100+ parts

-

1k+ parts

$0.325

10k+ parts

-

100

$0.339

-

$0.325

-

Continental Prestige Electronics

USA . 3,296 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

$0.339

3,296

$0.345

-

-

$0.339

Argo Parts USA

USA . 2,436 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

-

10k+ parts

$0.335

2,436

$0.345

-

-

$0.335

Corphita

USA . 1,410 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,410

$0.493

-

-

-

Parana Technologies

USA . 1,410 parts In-Stock

1+ parts

$1.938

100+ parts

-

1k+ parts

$2.473

10k+ parts

-

1,410

$1.938

-

$2.473

-

DigiPath Technology Company

USA . 339 parts In-Stock

1+ parts

$2.133

100+ parts

$1.963

1k+ parts

-

10k+ parts

-

339

$2.133

$1.963

-

-

ChromeModa Solutions

Germany . 4,421 parts In-Stock

1+ parts

$2.177

100+ parts

$1.785

1k+ parts

-

10k+ parts

-

4,421

$2.177

$1.785

-

-

IDEA Electronic Components Group

UK . 1,360 parts In-Stock

1+ parts

$2.177

100+ parts

-

1k+ parts

$1.959

10k+ parts

-

1,360

$2.177

-

$1.959

-

Corohmni

South Africa . 243 parts In-Stock

1+ parts

$11.601

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$11.601

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Infinite Electronics LLP (Excess)

. 595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

595

-

-

-

-

Overview

Elevate your power management game with the TLV840MADL32DBVRQ1 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This Power Management IC is perfect for automotive applications, offering seamless integration and efficient performance. With a compact design and a wide operating temperature range, this IC provides value and benefits that exceed expectations. Say goodbye to power supply issues and hello to smooth operation with the TLV840MADL32DBVRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and reliability to the product, making it a great choice for long-term use.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated into various electronic devices, enhancing its versatility.

Screening Level: AEC-Q100

Meeting the AEC-Q100 standard ensures high quality and reliability, making this IC suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on PCBs, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 0.9 V

The low nominal supply voltage makes this IC energy-efficient, which is beneficial for battery-powered devices.

No. of Terminals: 5

Having 5 terminals provides flexibility in connectivity options, allowing for versatile usage in various circuit configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style offers space-saving benefits while also providing a low profile design for compact applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environments, making it suitable for a wide range of applications.

Technical Specifications

Power Management ICs TLV840MADL32DBVRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

.7 V

Nominal Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TLV840MADL32DBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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