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TLV803EF26DBZR

Texas Instruments

TLV803EF26DBZR by Texas Instruments

TLV803EF26DBZR by Texas Instruments is a 3-terminal power management IC with nominal voltage of 3.3V, suitable for automotive applications. It has a small outline package style, matte tin terminal finish, and operates b/w -40 to 125°C temperature range. Ideal for power supply support circuits in compact designs.

Median Price

$0.372

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 605,317 parts In-Stock

1+ parts

$0.313

100+ parts

$0.213

1k+ parts

$0.109

10k+ parts

-

605,317

$0.313

$0.213

$0.109

-

DigiKey

USA . 10,750 parts In-Stock

1+ parts

$0.430

100+ parts

$0.231

1k+ parts

$0.196

10k+ parts

$0.177

10,750

$0.430

$0.231

$0.196

$0.177

Mouser Electronics

USA . 2,172 parts In-Stock

1+ parts

$0.430

100+ parts

$0.232

1k+ parts

$0.215

10k+ parts

-

2,172

$0.430

$0.232

$0.215

-

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.160

3,000

-

-

-

$0.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$0.212

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$0.212

-

-

-

Digiode

USA . 2,317 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

-

2,317

$0.297

-

-

-

Vyrian

USA . 156,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

156,475

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 156,486 parts In-Stock

1+ parts

$0.136

100+ parts

-

1k+ parts

-

10k+ parts

-

156,486

$0.136

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.208

100+ parts

-

1k+ parts

$0.200

10k+ parts

-

100

$0.208

-

$0.200

-

Continental Prestige Electronics

USA . 3,238 parts In-Stock

1+ parts

$0.212

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

3,238

$0.212

-

-

$0.208

Argo Parts USA

USA . 2,602 parts In-Stock

1+ parts

$0.212

100+ parts

-

1k+ parts

-

10k+ parts

$0.206

2,602

$0.212

-

-

$0.206

Corphita

USA . 1,783 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$0.282

-

-

-

Parana Technologies

USA . 808 parts In-Stock

1+ parts

$5.903

100+ parts

-

1k+ parts

$6.688

10k+ parts

-

808

$5.903

-

$6.688

-

DigiPath Technology Company

USA . 210 parts In-Stock

1+ parts

$6.500

100+ parts

$5.980

1k+ parts

-

10k+ parts

-

210

$6.500

$5.980

-

-

ChromeModa Solutions

Germany . 4,355 parts In-Stock

1+ parts

$6.633

100+ parts

$5.439

1k+ parts

-

10k+ parts

-

4,355

$6.633

$5.439

-

-

IDEA Electronic Components Group

UK . 228 parts In-Stock

1+ parts

$6.633

100+ parts

-

1k+ parts

$5.970

10k+ parts

-

228

$6.633

-

$5.970

-

Corohmni

South Africa . 8 parts In-Stock

1+ parts

$11.383

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$11.383

-

-

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,000

-

-

-

-

Overview

Experience unmatched reliability and performance with the TLV803EF26DBZR by Texas Instruments, a leader in Power Management ICs. This small outline, thin profile package offers a nominal supply voltage of 3.3V and a wide operating temperature range, making it perfect for automotive applications. Trust in Texas Instruments' reputation for quality and innovation as you benefit from the value and advantages this power supply support circuit provides. Upgrade your systems with the TLV803EF26DBZR and experience superior efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components, providing durability and protection for the IC.

Surface Mount: YES

Ease of integration into circuit boards and space-saving design.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for various applications that require a stable 3.3V power supply.

Maximum Operating Temperature: 125 °C

Can operate in higher temperature environments, making it suitable for industrial or automotive applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, ensuring reliable performance in various environments.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance for the terminals.

Minimum Supply Voltage (Vsup): 1.7 V

Allows for operation even at lower supply voltages, increasing flexibility in power source options.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and reliability, making it suitable for automotive applications.

Maximum Supply Current (Isup): 0.0012 mA

Low power consumption, ideal for energy-efficient devices and prolonging battery life.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs and provides mechanical stability.

Maximum Supply Voltage (Vsup): 6 V

Can handle higher supply voltages, offering flexibility in power source options.

Technical Specifications

Power Management ICs TLV803EF26DBZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.64

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

TLV803EF26DBZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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