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TLV809EA46DBZR

Texas Instruments

TLV809EA46DBZR by Texas Instruments

TLV809EA46DBZR by Texas Instruments is a 3-terminal Power Management IC with a nominal voltage of 3.3 V and min operating temperature of -40 °C. It is designed for automotive applications, featuring a small outline package style and matte tin terminal finish.

Median Price

$0.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 432,558 parts In-Stock

1+ parts

$0.181

100+ parts

$0.123

1k+ parts

$0.063

10k+ parts

-

432,558

$0.181

$0.123

$0.063

-

Mouser Electronics

USA . 5,717 parts In-Stock

1+ parts

$0.270

100+ parts

$0.139

1k+ parts

$0.116

10k+ parts

$0.105

5,717

$0.270

$0.139

$0.116

$0.105

DigiKey

USA . 4,857 parts In-Stock

1+ parts

$0.270

100+ parts

$0.139

1k+ parts

$0.116

10k+ parts

$0.104

4,857

$0.270

$0.139

$0.116

$0.104

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 963 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

-

10k+ parts

-

963

$0.172

-

-

-

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

-

10k+ parts

-

94

$0.240

-

-

-

Vyrian

USA . 147,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147,119

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 146,957 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

10k+ parts

-

146,957

$0.088

-

-

-

Corphita

USA . 4,511 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

-

10k+ parts

-

4,511

$0.163

-

-

-

Continental Prestige Electronics

USA . 5,143 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

-

10k+ parts

$0.235

5,143

$0.240

-

-

$0.235

Argo Parts USA

USA . 3,249 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

-

10k+ parts

$0.232

3,249

$0.240

-

-

$0.232

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$0.240

-

-

-

Parana Technologies

USA . 1,559 parts In-Stock

1+ parts

$12.049

100+ parts

-

1k+ parts

$12.456

10k+ parts

-

1,559

$12.049

-

$12.456

-

DigiPath Technology Company

USA . 585 parts In-Stock

1+ parts

$13.267

100+ parts

-

1k+ parts

-

10k+ parts

-

585

$13.267

-

-

-

ChromeModa Solutions

Germany . 3,784 parts In-Stock

1+ parts

$13.538

100+ parts

$11.101

1k+ parts

-

10k+ parts

-

3,784

$13.538

$11.101

-

-

IDEA Electronic Components Group

UK . 994 parts In-Stock

1+ parts

$13.538

100+ parts

$12.861

1k+ parts

$12.184

10k+ parts

-

994

$13.538

$12.861

$12.184

-

Overview

Unlock reliable power management with the TLV809EA46DBZR by Texas Instruments. Designed with precision and expertise, this Power Management IC offers unparalleled quality and performance. Ideal for automotive applications, this small outline package delivers a nominal supply voltage of 3.3V, ensuring consistent and efficient power supply. Discover the value of seamless functionality and trust in the advantages that Texas Instruments brings to your projects. Elevate your power management solutions with the TLV809EA46DBZR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for portable devices.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic applications, ensuring compatibility.

No. of Terminals: 3

Having only 3 terminals simplifies the connectivity and reduces complexity in circuit design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to function reliably in a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can withstand cold conditions without malfunctioning.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and long-term reliability.

Width (mm): 1.3 mm

The small width makes the product compact and suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage allows the product to operate efficiently even with low-power sources.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product can withstand high temperature variations expected in automotive environments.

Maximum Supply Current (Isup): 0.0012 mA

The low maximum supply current helps in reducing power consumption and improving energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage allows flexibility in power input options for the product.

Technical Specifications

Power Management ICs TLV809EA46DBZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.12 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

4.63

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.3 mm

Trade Compliance

TLV809EA46DBZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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