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TLV840NADL33DBVR

Texas Instruments

TLV840NADL33DBVR by Texas Instruments

TLV840NADL33DBVR by Texas Instruments is a Power Management IC with 5 terminals, operating b/w -40 to 125 °C. It has a nominal voltage of 1.5 V and threshold voltage of +3.3V, suitable for automotive applications due to its small outline package style and low profile design.

Median Price

$0.610

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 48,842 parts In-Stock

1+ parts

$0.479

100+ parts

$0.326

1k+ parts

$0.167

10k+ parts

-

48,842

$0.479

$0.326

$0.167

-

Mouser Electronics

USA . 8,197 parts In-Stock

1+ parts

$0.610

100+ parts

$0.340

1k+ parts

$0.317

10k+ parts

-

8,197

$0.610

$0.340

$0.317

-

DigiKey

USA . 2,431 parts In-Stock

1+ parts

$0.610

100+ parts

$0.340

1k+ parts

$0.290

10k+ parts

$0.265

2,431

$0.610

$0.340

$0.290

$0.265

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.275

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.275

-

-

-

Digiode

USA . 1,577 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

-

1,577

$0.455

-

-

-

Vyrian

USA . 21,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,106

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,457 parts In-Stock

1+ parts

$0.275

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

6,457

$0.275

-

-

$0.270

Argo Parts USA

USA . 2,246 parts In-Stock

1+ parts

$0.275

100+ parts

-

1k+ parts

-

10k+ parts

$0.267

2,246

$0.275

-

-

$0.267

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.275

100+ parts

-

1k+ parts

$0.261

10k+ parts

$0.256

1,000

$0.275

-

$0.261

$0.256

Corphita

USA . 4,265 parts In-Stock

1+ parts

$0.431

100+ parts

-

1k+ parts

-

10k+ parts

-

4,265

$0.431

-

-

-

Ampacity Inc.

Singapore . 21,229 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

21,229

$0.890

-

-

-

Parana Technologies

USA . 1,425 parts In-Stock

1+ parts

$18.441

100+ parts

-

1k+ parts

$18.560

10k+ parts

-

1,425

$18.441

-

$18.560

-

DigiPath Technology Company

USA . 1,344 parts In-Stock

1+ parts

$20.306

100+ parts

$18.681

1k+ parts

-

10k+ parts

-

1,344

$20.306

$18.681

-

-

ChromeModa Solutions

Germany . 1,172 parts In-Stock

1+ parts

$20.720

100+ parts

$16.990

1k+ parts

-

10k+ parts

-

1,172

$20.720

$16.990

-

-

IDEA Electronic Components Group

UK . 432 parts In-Stock

1+ parts

$20.720

100+ parts

$19.684

1k+ parts

$18.648

10k+ parts

-

432

$20.720

$19.684

$18.648

-

Lixinc

USA . 15,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,290

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 9,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,850

-

-

-

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A-Z Elektronik GmbH

Germany . 2,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,900

-

-

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-

Overview

Enhance your power management solutions with the TLV840NADL33DBVR by Texas Instruments. Manufactured with top-notch quality and reliability, this Power Management IC offers unparalleled value and benefits to customers. Ideal for automotive applications, this compact and efficient IC guarantees optimal performance in a wide range of operating temperatures. Say goodbye to power supply issues and experience seamless functionality with the TLV840NADL33DBVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, making the product sturdy and easy to handle.

Surface Mount: YES

Easily mountable on circuit boards, allowing for efficient and space-saving installation.

Nominal Supply Voltage (Vsup): 1.5 V

Optimal supply voltage for the product, ensuring consistent and reliable performance.

Maximum Operating Temperature: 125 °C

High operating temperature range, suitable for demanding environments or applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature, making the product suitable for various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for better conductivity and durability.

Width (mm): 1.6 mm

Compact width for space-constrained applications.

Minimum Supply Voltage (Vsup): 0.7 V

Low minimum supply voltage requirement, allowing for energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature for proper soldering during assembly.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance.

Terminal Pitch: 0.95 mm

Fine terminal pitch for precise connections and compact layout.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage for versatility in different power input scenarios.

Technical Specifications

Power Management ICs TLV840NADL33DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

.7 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TLV840NADL33DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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