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TLC548CDG4

Texas Instruments

TLC548CDG4 by Texas Instruments

TLC548CDG4 by Texas Instruments is an 8-bit ADC with 0.1953% linearity error, 5V supply, and 0.0455 MHz sample rate. Ideal for commercial applications requiring fast conversion time and low power consumption. Package style: small outline, terminal form: gull wing, output format: serial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,603 parts In-Stock

1+ parts

-

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1k+ parts

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6,603

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Digiode

USA . 3,443 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,443

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,733 parts In-Stock

1+ parts

$13.075

100+ parts

-

1k+ parts

$13.569

10k+ parts

-

1,733

$13.075

-

$13.569

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ChromeModa Solutions

Germany . 4,250 parts In-Stock

1+ parts

$14.691

100+ parts

$12.047

1k+ parts

-

10k+ parts

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4,250

$14.691

$12.047

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IDEA Electronic Components Group

UK . 1,428 parts In-Stock

1+ parts

$14.691

100+ parts

$13.956

1k+ parts

$13.222

10k+ parts

-

1,428

$14.691

$13.956

$13.222

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AZTECH Wire

Italy . 206 parts In-Stock

1+ parts

$15.714

100+ parts

-

1k+ parts

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10k+ parts

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206

$15.714

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One Stop Electronics

USA . 1,549 parts In-Stock

1+ parts

$32.000

100+ parts

-

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1,549

$32.000

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Corphita

USA . 1,695 parts In-Stock

1+ parts

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1,695

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DigiPath Technology Company

USA . 1,431 parts In-Stock

1+ parts

-

100+ parts

$13.245

1k+ parts

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1,431

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$13.245

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Microchip USA

USA . 1,274 parts In-Stock

1+ parts

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1,274

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Overview

Unlock the power of precision and reliability with the TLC548CDG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and innovation in their Analog-to-Digital Converters. Ideal for a wide range of applications, this small outline package offers customers high performance and accuracy with a maximum linearity error of just 0.1953%. With a sample rate of 0.0455 MHz and a fast conversion time of 17 us, this converter is perfect for demanding projects where speed and accuracy are crucial. Trust in Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

No. of Bits: 8

Provides a good balance between resolution and speed for most applications requiring analog-to-digital conversion.

Power Supplies (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Maximum Conversion Time: 17 us

Offers fast conversion times, allowing for real-time processing of analog signals.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, resulting in reliable and efficient operation.

Technical Specifications

Analog-to-Digital Converters TLC548CDG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

45.5 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC548CDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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