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TLC542IDW

Texas Instruments

TLC542IDW by Texas Instruments

TLC542IDW by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 0.04 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion within a temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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DigiKey Marketplace

USA . 11,307 parts In-Stock

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Vyrian

USA . 4,417 parts In-Stock

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Digiode

USA . 1,299 parts In-Stock

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R&J Components

USA . 1,046 parts In-Stock

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Chip Stock

USA . 387 parts In-Stock

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ComSIT Distribution GmbH

Germany . 95 parts In-Stock

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Parana Technologies

USA . 1,352 parts In-Stock

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$6.987

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$7.556

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DigiPath Technology Company

USA . 1,510 parts In-Stock

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$7.694

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$7.078

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$7.694

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ChromeModa Solutions

Germany . 4,165 parts In-Stock

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$7.851

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$6.438

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IDEA Electronic Components Group

UK . 2,361 parts In-Stock

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$7.066

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AZTECH Wire

Italy . 214 parts In-Stock

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$8.657

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$26.103

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One Stop Electronics

USA . 570 parts In-Stock

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$37.000

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Authorized Procurement Solutions

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Corphita

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Perfect Parts

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Microchip USA

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Assy Fe

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Overview

Experience the superior quality and precision of the TLC542IDW from Texas Instruments, a leading manufacturer in analog-to-digital converters. This versatile product offers 11 analog input channels, a small outline package style, and a maximum conversion time of just 20 microseconds. Perfect for industrial applications, this ADC provides accurate data conversion with a low linearity error of 0.1953%. Trust Texas Instruments for reliable performance and unmatched value in your next project.

Feature Benefit Bullets

No. of Analog In Channels: 11

Having 11 analog input channels allows for a greater range of input sources to be monitored, making this product versatile and suitable for various applications.

No. of Bits: 8

With 8 bits of resolution, this ADC can provide detailed and accurate digital representation of the analog signals it processes, making it suitable for precise measurements.

Maximum Linearity Error (EL): 0.1953%

The low linearity error ensures that the output values closely match the input values, resulting in high accuracy and reliability in signal conversion.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand harsh temperature environments, expanding its usability in industrial applications.

Technology: CMOS

Being based on CMOS technology, this ADC offers low power consumption and high noise immunity, making it energy-efficient and reliable for various applications.

Technical Specifications

Analog-to-Digital Converters TLC542IDW attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

2 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC542IDW Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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