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TLC542CDWR

Texas Instruments

TLC542CDWR by Texas Instruments

TLC542CDWR by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 20 terminals. It operates b/w 0-70°C and has a sample rate of 0.04 MHz. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments.

Median Price

$2.540

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$0.460

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$0.460

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Rochester

USA . 3,380 parts In-Stock

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$2.540

100+ parts

$2.490

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$2.440

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3,380

$2.540

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$2.440

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Chip1Stop

Japan . 1 parts In-Stock

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$3.120

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$3.120

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Digiode

USA . 4,186 parts In-Stock

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$0.437

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$0.437

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Component Electronics Inc.

Canada . 2,250 parts In-Stock

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$2.310

100+ parts

$1.730

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$1.500

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2,250

$2.310

$1.730

$1.500

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Chip Stock

USA . 7,080 parts In-Stock

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Vyrian

USA . 2,549 parts In-Stock

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2,549

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Cyclops Electronics Ltd

UK . 277 parts In-Stock

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ComSIT Distribution GmbH

Germany . 116 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,181 parts In-Stock

1+ parts

$0.414

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3,181

$0.414

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Component Stockers USA

USA . 8,083 parts In-Stock

1+ parts

$2.780

100+ parts

$2.610

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$2.430

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8,083

$2.780

$2.610

$2.430

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Parana Technologies

USA . 2,076 parts In-Stock

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$10.597

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$11.097

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2,076

$10.597

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$11.097

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ChromeModa Solutions

Germany . 913 parts In-Stock

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$11.907

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$9.764

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913

$11.907

$9.764

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IDEA Electronic Components Group

UK . 467 parts In-Stock

1+ parts

$11.907

100+ parts

$11.312

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$10.716

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467

$11.907

$11.312

$10.716

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AZTECH Wire

Italy . 585 parts In-Stock

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$20.580

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Perfect Parts

USA . 10,491 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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DigiPath Technology Company

USA . 2,298 parts In-Stock

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$10.735

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$10.735

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Kepictronics

USA . 381 parts In-Stock

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Futuretech Components

Singapore . 115 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments TLC542CDWR Analog-to-Digital Converter. Known for its superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. With 11 analog input channels and quick conversion time, this ADC is perfect for applications requiring precision and speed. From industrial automation to consumer electronics, the TLC542CDWR offers value, accuracy, and efficiency to meet your design needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the Analog-to-Digital Converter, ensuring longevity and reliability.

No. of Analog In Channels: 11

Having 11 analog input channels allows for versatile and complex signal processing, making this ADC suitable for applications requiring multiple input sources.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Bits: 8

The 8-bit resolution provides sufficient accuracy for many applications while keeping costs lower compared to higher bit ADCs.

Maximum Linearity Error (EL): 0.1953 %

The low linearity error ensures accurate conversion of analog signals to digital, making this ADC suitable for precise measurement applications.

No. of Terminals: 20

Having 20 terminals allows for easy connectivity and integration into circuit designs, providing flexibility for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs while offering convenience for compact designs in tight spaces.

Maximum Operating Temperature: 70 °C

The wide operating temperature range of up to 70°C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures functionality in both cold and hot climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and reliable electrical connections, enhancing the durability of the ADC.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and component placement, allowing for efficient circuit designs.

Maximum Conversion Time: 20 us

The fast conversion time of 20 microseconds enables quick processing of analog inputs, making this ADC suitable for real-time applications.

Maximum Seated Height: 2.65 mm

The low seated height allows for slim and compact device designs, ideal for space-constrained applications.

Width: 7.5 mm

The compact width dimension of 7.5 mm contributes to the overall small form factor of the ADC, facilitating integration into tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow time of 30 seconds minimizes thermal stress on the ADC during assembly processes, ensuring component reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for lead-free soldering processes, complying with environmental regulations.

Length: 12.8 mm

The moderate length dimension of 12.8 mm balances size and functionality, making this ADC suitable for various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this ADC is suitable for standard operating conditions, meeting the needs of most commercial applications.

Maximum Analog Input Voltage: 5.5 V

The high maximum analog input voltage tolerance of 5.5 volts allows for compatibility with a wide range of analog input signals.

Sample Rate: 0.04 MHz

The sample rate of 0.04 MHz enables efficient conversion of analog signals to digital data, suitable for various signal processing applications.

Technology: CMOS

The CMOS technology used in this ADC offers low power consumption and high noise immunity, making it energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring robust connections for the ADC.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers a good balance between speed and accuracy, making this ADC suitable for a wide range of applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 volts is a common and easily attainable power source, simplifying integration into existing systems.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making it compatible with standard digital systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy connection to PCBs and other components, ensuring compatibility with standard spacing requirements.

Minimum Analog Input Voltage: 0 V

The minimum analog input voltage tolerance of 0 volts ensures that even low-level signals can be accurately converted, enhancing the versatility of this ADC.

Output Format: SERIAL

The serial output format simplifies data transmission and communication with other digital devices, making this ADC suitable for interfacing with various systems.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold function allows for accurate sampling of analog signals without distortion, ensuring precise data conversion in the ADC.

Technical Specifications

Analog-to-Digital Converters TLC542CDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC542CDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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