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ADS7809UBG4

Texas Instruments

ADS7809UBG4 by Texas Instruments

The Texas Instruments ADS7809UBG4 is a 16-bit ADC with 0.0031% EL, 1 analog in channel, and 5V supply. Ideal for industrial applications, it offers a sample rate of 0.1 MHz and operates b/w -40 to 85°C. With a small outline package style, it suits surface mount designs requiring high precision conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,352 parts In-Stock

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3,352

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Vyrian

USA . 3,220 parts In-Stock

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3,220

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VNN

France . 2,414 parts In-Stock

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2,414

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Semicontronic

India . 1,504 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

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-

1,504

$3.000

$2.925

$2.910

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AZTECH Wire

Italy . 885 parts In-Stock

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$9.949

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885

$9.949

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Parana Technologies

USA . 984 parts In-Stock

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$15.934

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$16.288

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984

$15.934

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$16.288

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DigiPath Technology Company

USA . 2,275 parts In-Stock

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$17.545

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$16.141

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$17.545

$16.141

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ChromeModa Solutions

Germany . 6,887 parts In-Stock

1+ parts

$17.903

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$14.680

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$17.903

$14.680

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IDEA Electronic Components Group

UK . 552 parts In-Stock

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$17.903

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$17.008

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$16.113

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552

$17.903

$17.008

$16.113

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Corohmni

South Africa . 8 parts In-Stock

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$20.957

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8

$20.957

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Advanced Electronics

New Zealand . 37 parts In-Stock

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$24.185

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$22.976

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$22.976

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37

$24.185

$22.976

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One Stop Electronics

USA . 1,506 parts In-Stock

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$37.000

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$37.000

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Ampacity Inc.

Singapore . 1,106 parts In-Stock

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$38.000

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iodParts Technologies Inc.

India . 7,200 parts In-Stock

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Argo Parts USA

USA . 2,893 parts In-Stock

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Corphita

USA . 2,560 parts In-Stock

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2,560

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Continental Prestige Electronics

USA . 1,945 parts In-Stock

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Bastille Electronics

Australia . 600 parts In-Stock

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600

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GreenTree Electronics

Israel . 476 parts In-Stock

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476

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Overview

Unlock unparalleled precision and reliability with the Texas Instruments ADS7809UBG4 Analog-to-Digital Converter. Crafted by industry leader Texas Instruments, this converter boasts unmatched quality and performance. Ideal for a wide range of applications, this converter offers customers exceptional value and benefits. Experience seamless operation and superior results with the ADS7809UBG4, setting a new standard in analog-to-digital conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

No. of Analog In Channels: 1

Having 1 analog input channel simplifies the setup and ensures accurate conversion of analog signals.

Surface Mount: YES

This feature allows for easy integration into circuit boards, saving space and facilitating mass production.

No. of Functions: 1

With one function, the product focuses on analog-to-digital conversion efficiency and accuracy.

Package Shape: RECTANGULAR

The rectangular shape is common and easy to fit into standardized designs.

No. of Bits: 16

A 16-bit resolution provides high precision in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0031%

The low linearity error ensures accurate representation of analog signals in digital form.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 20

With 20 terminals, the product offers flexibility for connecting to various components in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature covers a wide range of operational environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal position offers redundancy and ensures secure connections.

Maximum Conversion Time: 8 us

With a fast conversion time, the product can quickly process analog signals into digital data.

Maximum Seated Height: 2.65 mm

The low seated height enables compact circuit designs and reduces overall product size.

Width: 7.5 mm

A narrow width is ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The brief reflow time at peak temperature prevents overheating during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures solder joints are properly bonded and durable.

Length: 12.8 mm

The moderate length provides a balance between compactness and ease of handling.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the product can operate in harsh industrial environments.

Maximum Analog Input Voltage: 10 V

The high maximum input voltage accommodates a wide range of analog signal levels.

Sample Rate: 0.1 MHz

With a high sample rate, the product can accurately capture rapid changes in analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals are robust and easy to solder, ensuring secure connections.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADCs offer high accuracy and resolution in converting analog signals.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage ensures compatibility and stability in various systems.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

The binary output code is standard and widely compatible with digital systems.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies the integration of the product into circuit boards.

Minimum Analog Input Voltage: -10 V

The low minimum input voltage allows for the conversion of negative analog signals.

Output Format: SERIAL

Serial output format makes it easy to connect the product to microcontrollers and other digital devices.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature ensures accurate conversion of varying analog signals.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the product can withstand moderate exposure to humidity during storage and handling.

Technical Specifications

Analog-to-Digital Converters ADS7809UBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

100 kHz

Hold Mode:

Sample

Maximum Conversion Time:

8 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7809UBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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