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TL16C552AFNR

Texas Instruments

TL16C552AFNR by Texas Instruments

TL16C552AFNR by Texas Instruments is a Serial Communication Controller with 5V power supply, 0-70°C operating temperature range, and 0.125 MBps data transfer rate. It is ideal for IBM PC-AT bus compatibility, offering 2 serial I/Os and supporting ASYNC communication protocol.

Median Price

$9.675

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$12.380

100+ parts

$8.340

1k+ parts

$7.550

10k+ parts

-

500

$12.380

$8.340

$7.550

-

DigiKey

USA . 239 parts In-Stock

1+ parts

$12.380

100+ parts

$8.337

1k+ parts

$7.676

10k+ parts

$7.559

239

$12.380

$8.337

$7.676

$7.559

Chip1Stop

Japan . 130 parts In-Stock

1+ parts

-

100+ parts

$0.852

1k+ parts

-

10k+ parts

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130

-

$0.852

-

-

Rochester

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$6.970

1k+ parts

$6.240

10k+ parts

$5.870

36

-

$6.970

$6.240

$5.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,315 parts In-Stock

1+ parts

$5.178

100+ parts

-

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3,315

$5.178

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Vyrian

USA . 2,724 parts In-Stock

1+ parts

-

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2,724

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Chip Stock

USA . 625 parts In-Stock

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625

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

1+ parts

-

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-

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1

-

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Bristol Electronics

USA . 1 parts In-Stock

1+ parts

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1

-

-

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Dan-Mar Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

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1

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 165 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

-

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165

$4.630

-

-

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Corphita

USA . 2,345 parts In-Stock

1+ parts

$4.905

100+ parts

-

1k+ parts

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2,345

$4.905

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-

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Parana Technologies

USA . 356 parts In-Stock

1+ parts

$53.024

100+ parts

-

1k+ parts

-

10k+ parts

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356

$53.024

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-

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DigiPath Technology Company

USA . 582 parts In-Stock

1+ parts

$58.386

100+ parts

$53.716

1k+ parts

-

10k+ parts

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582

$58.386

$53.716

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-

ChromeModa Solutions

Germany . 1,516 parts In-Stock

1+ parts

$59.578

100+ parts

$48.854

1k+ parts

-

10k+ parts

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1,516

$59.578

$48.854

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IDEA Electronic Components Group

UK . 223 parts In-Stock

1+ parts

$59.578

100+ parts

$56.599

1k+ parts

$53.620

10k+ parts

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223

$59.578

$56.599

$53.620

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A-Z Elektronik GmbH

Germany . 5,121 parts In-Stock

1+ parts

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5,121

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Lixinc

USA . 3,709 parts In-Stock

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3,709

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QUARKTWIN TECHNOLOGY LTD

USA . 3,368 parts In-Stock

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3,368

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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1,500

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Perfect Parts

USA . 1,268 parts In-Stock

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1,268

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Metaverse IC Inc.

Canada . 850 parts In-Stock

1+ parts

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850

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Futuretech Components

Singapore . 496 parts In-Stock

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496

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Kepictronics

USA . 436 parts In-Stock

1+ parts

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436

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Overview

Enhance your communication systems with the TL16C552AFNR by Texas Instruments, a top-tier manufacturer known for high-quality products. This Serial Communication Controller offers seamless integration into various applications, providing reliable and efficient data transfer. With a focus on value and benefits, this chip carrier package ensures optimal performance with a maximum supply voltage of 5.25V and a maximum data transfer rate of 0.125 MBps. Trust Texas Instruments to deliver cutting-edge technology that surpasses expectations. Upgrade your systems today and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the internal components of the controller, ensuring a longer lifespan.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this controller can perform reliably even in high temperature environments.

Maximum Data Transfer Rate: 0.125 MBps

This high data transfer rate of 0.125 MBps allows for efficient and fast communication between devices, making it suitable for applications that require quick data transmission.

External Data Bus Width: 8

The wide external data bus width of 8 enables the controller to handle large amounts of data simultaneously, improving overall performance and throughput.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16 MHz allows for fast processing speeds, making this controller suitable for applications that require high-speed communication.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this controller is less prone to moisture damage, making it suitable for use in various environments.

Technical Specifications

Serial Communication Controllers TL16C552AFNR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552AFNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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