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TIBPAL16L8-20MWB

Texas Instruments

TIBPAL16L8-20MWB by Texas Instruments

TIBPAL16L8-20MWB by Texas Instruments is a 20 ns TTL PLD with 16 inputs, 64 product terms, and 8 outputs. It is used in MIL-grade applications for combinatorial output functions at up to 40 MHz clock frequency. The device comes in a ceramic package with flat terminals and operates b/w -55°C to 125°C temperature range.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 9,067 parts In-Stock

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Digiode

USA . 2,006 parts In-Stock

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Resion

USA . 34 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Atlantic Semiconductor

USA . 10 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 6 parts In-Stock

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AZTECH Wire

Italy . 390 parts In-Stock

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$7.861

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One Stop Electronics

USA . 1,170 parts In-Stock

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Parana Technologies

USA . 2,092 parts In-Stock

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$155.742

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$14,463.006

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$140.168

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DigiPath Technology Company

USA . 1,181 parts In-Stock

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$171.491

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$157.772

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ChromeModa Solutions

Germany . 3,601 parts In-Stock

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$174.991

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$143.493

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

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$157.492

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Corphita

USA . 2,169 parts In-Stock

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Microchip USA

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Overview

Unlock the power of programmable logic devices with the TIBPAL16L8-20MWB from Texas Instruments. Designed with precision and reliability in mind, this PAL-type device offers lightning-fast propagation delay of 20 ns, making it ideal for a wide range of applications. With a maximum clock frequency of 40 MHz and 64 product terms, this PLD delivers exceptional performance and versatility. Whether you're designing industrial control systems or consumer electronics, the TIBPAL16L8-20MWB provides the flexibility and efficiency you need to bring your ideas to life. Trust Texas Instruments for quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures high durability and reliability of the product, making it suitable for harsh environments.

Propagation Delay: 20 ns

With a low propagation delay of 20 ns, this PLD offers fast processing speed, making it ideal for applications where quick response time is critical.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power supply options and supports a wide range of applications.

Technology Used: TTL

The use of TTL technology ensures compatibility with a wide range of systems and devices, enhancing the overall versatility of the PLD.

No. of Inputs: 16

With 16 inputs available, this PLD can accommodate a larger number of input signals, making it suitable for complex logic operations.

Output Function: COMBINATORIAL

The combinatorial output function allows for flexible logic design and implementation, enabling the PLD to perform a variety of operations efficiently.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this PLD can handle high-speed operations, making it suitable for applications that require rapid processing.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-20MWB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

40 MHz

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL20,.3

Width:

6.92 mm

Length:

13.09 mm

Maximum Seated Height:

2.45 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-PRF-38535

Trade Compliance

TIBPAL16L8-20MWB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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