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TGD0623XSMX

Texas Instruments

TGD0623XSMX by Texas Instruments

TGD0623XSMX by Texas Instruments is a single microwave mixer diode with Schottky technology. It operates in the very high frequency to millimeter wave band, suitable for applications requiring isolated case connection. This surface-mount diode has a ceramic, metal-sealed co-fired package body and wrap-around terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,555 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,555

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Digiode

USA . 1,794 parts In-Stock

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1,794

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 463 parts In-Stock

1+ parts

$0.171

100+ parts

-

1k+ parts

$1.509

10k+ parts

-

463

$0.171

-

$1.509

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DigiPath Technology Company

USA . 1,538 parts In-Stock

1+ parts

$0.188

100+ parts

$0.173

1k+ parts

-

10k+ parts

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1,538

$0.188

$0.173

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ChromeModa Solutions

Germany . 1,899 parts In-Stock

1+ parts

$0.192

100+ parts

$0.157

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-

10k+ parts

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1,899

$0.192

$0.157

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IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

$0.173

10k+ parts

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1,825

$0.192

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$0.173

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Ampacity Inc.

Singapore . 1,129 parts In-Stock

1+ parts

$2.010

100+ parts

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1,129

$2.010

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One Stop Electronics

USA . 967 parts In-Stock

1+ parts

$2.010

100+ parts

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967

$2.010

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Semicontronic

India . 340 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

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340

$2.010

$1.960

$1.950

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AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$10.299

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355

$10.299

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Corohmni

South Africa . 269 parts In-Stock

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269

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Corphita

USA . 225 parts In-Stock

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225

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Overview

Elevate your microwave mixing and detecting capabilities with the TGD0623XSMX by Texas Instruments. Crafted with precision and expertise, this mixer diode offers unparalleled performance in very high frequency to millimeter wave band applications. Its ceramic, metal-sealed co-fired package ensures durability and reliability, making it ideal for a wide range of industrial and commercial uses. Experience seamless integration with its surface mount design and benefit from its Schottky technology that delivers superior signal quality. Trust Texas Instruments for cutting-edge solutions that elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package material provides high reliability and durability, making it suitable for demanding applications.

Config: SINGLE

Single configuration simplifies the setup and operation of the product, making it user-friendly.

Frequency Band: VERY HIGH FREQUENCY TO MILLIMETER WAVE BAND

Wide frequency band coverage allows for versatile use across different frequency ranges, enhancing the product's flexibility.

Surface Mount: YES

The surface mount feature enables easy integration into circuit boards, saving space and facilitating assembly.

Package Shape: ROUND

The round package shape promotes efficient heat dissipation and minimizes signal interference, improving overall performance.

No. of Terminals: 2

Having only 2 terminals simplifies the connection and reduces the chances of wiring errors, enhancing reliability.

Package Style (Meter): LONG FORM

The long form package style provides stability and ease of handling during installation and maintenance.

Terminal Position: END

End terminal position ensures proper alignment and connectivity, leading to consistent and reliable performance.

Case Connection: ISOLATED

Isolated case connection helps prevent signal interference and ensures accurate signal processing.

Diode Type: MIXER DIODE

The mixer diode design allows for signal mixing and frequency conversion, enabling versatile functionality in various applications.

Technology: SCHOTTKY

Schottky technology offers fast switching speeds and low forward voltage drop, improving overall efficiency and performance.

Terminal Form: WRAP AROUND

Wrap around terminal form provides secure connections and minimizes the risk of disconnection, ensuring long-term reliability.

Diode Element Material: GALLIUM ARSENIDE

Gallium arsenide diode element material offers high speed and efficiency, making it ideal for high-frequency applications.

Technical Specifications

Microwave Mixer & Detector Diodes TGD0623XSMX attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from Texas Instruments

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

GALLIUM ARSENIDE

Diode Type:

Frequency Band:

VERY HIGH FREQUENCY TO MILLIMETER WAVE BAND

JESD-30 Code:

O-CELF-R2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

END

Trade Compliance

TGD0623XSMX Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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