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TCM1536P

Texas Instruments

TCM1536P by Texas Instruments

Texas Instruments TCM1536P is a BICMOS Telephone Line IC with 8 terminals in an IN-LINE package. It operates b/w -20 to 70°C, drawing 0.0013 mA current. Ideal for TELEPHONE RINGER CIRCUIT applications due to its compact size and commercial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,050 parts In-Stock

1+ parts

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3,050

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LWI Electronics Inc

India . 2,750 parts In-Stock

1+ parts

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2,750

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Vyrian

USA . 2,176 parts In-Stock

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2,176

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$11.405

100+ parts

-

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820

$11.405

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Parana Technologies

USA . 1,634 parts In-Stock

1+ parts

$15.212

100+ parts

-

1k+ parts

$15.611

10k+ parts

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1,634

$15.212

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$15.611

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DigiPath Technology Company

USA . 1,175 parts In-Stock

1+ parts

$16.750

100+ parts

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1,175

$16.750

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ChromeModa Solutions

Germany . 5,513 parts In-Stock

1+ parts

$17.092

100+ parts

$14.015

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5,513

$17.092

$14.015

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IDEA Electronic Components Group

UK . 1,713 parts In-Stock

1+ parts

$17.092

100+ parts

$16.237

1k+ parts

$15.383

10k+ parts

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1,713

$17.092

$16.237

$15.383

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One Stop Electronics

USA . 670 parts In-Stock

1+ parts

$604.000

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670

$604.000

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Corphita

USA . 3,037 parts In-Stock

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3,037

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Metaverse IC Inc.

Canada . 2,474 parts In-Stock

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2,474

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Overview

Elevate your communication devices with the TCM1536P by Texas Instruments, a top-of-the-line Telephone Line IC that sets the standard for quality and reliability. Designed with precision and innovation, this product offers unmatched performance and versatility for a wide range of applications in the telecom industry. With Texas Instruments' reputation for excellence, you can trust that the TCM1536P delivers exceptional value, benefits, and advantages to meet all your communication needs. Choose the TCM1536P and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring it can withstand various environmental conditions.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options, making the IC versatile and suitable for various telephone line applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in warmer environments, adding to the overall product reliability.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption, making the IC energy-efficient.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Being specifically designed for telephone ringer circuit applications ensures the IC is optimized for this particular function, providing high-quality performance.

Technical Specifications

Telephone Line ICs TCM1536P attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0013 mA

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM1536P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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