Loading...

TBP28L45J

Texas Instruments

TBP28L45J by Texas Instruments

TBP28L45J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 60ns max access time. It operates at a nominal voltage of 5V, suitable for commercial temperature grades. This rectangular ceramic package with 24 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,825

-

-

-

-

Digiode

USA . 1,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,732

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,274 parts In-Stock

1+ parts

$3.853

100+ parts

-

1k+ parts

$4.337

10k+ parts

-

2,274

$3.853

-

$4.337

-

IDEA Electronic Components Group

UK . 757 parts In-Stock

1+ parts

$4.329

100+ parts

-

1k+ parts

$3.896

10k+ parts

-

757

$4.329

-

$3.896

-

ChromeModa Solutions

Germany . 130 parts In-Stock

1+ parts

$4.329

100+ parts

$3.550

1k+ parts

-

10k+ parts

-

130

$4.329

$3.550

-

-

One Stop Electronics

USA . 790 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$15.000

-

-

-

AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$17.639

100+ parts

-

1k+ parts

-

10k+ parts

-

783

$17.639

-

-

-

Corphita

USA . 3,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,069

-

-

-

-

DigiPath Technology Company

USA . 596 parts In-Stock

1+ parts

-

100+ parts

$3.903

1k+ parts

-

10k+ parts

-

596

-

$3.903

-

-

Overview

Unlock endless possibilities with the TBP28L45J by Texas Instruments. Crafted with precision and reliability in mind, this OTP ROM offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers seamless functionality with a nominal supply voltage of 5V. Experience the quality and innovation that Texas Instruments is known for, and elevate your projects to new heights with the TBP28L45J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and durability, ensuring the product can withstand high operating temperatures and mechanical stress.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most systems and ensures stable performance.

Organization: 512X8

Having an organization of 512 words by 8 bits allows for a decent amount of storage capacity and data manipulation capabilities.

Technology: TTL

Using TTL technology provides fast switching speeds and low power consumption, making the product efficient in terms of performance and energy usage.

Memory IC Type: OTP ROM

Being a OTP ROM (One-Time Programmable Read-Only Memory) ensures data integrity and security, making it a reliable choice for storing critical information.

Technical Specifications

OTP ROM TBP28L45J attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

60 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TBP28L45J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20