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TBP24S81-55JP4

Texas Instruments

TBP24S81-55JP4 by Texas Instruments

TBP24S81-55JP4 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density and 55ns max access time. It operates b/w 0°C to 70°C, ideal for commercial applications requiring reliable non-volatile memory storage in a ceramic rectangular package with 18 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,135 parts In-Stock

1+ parts

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7,135

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Digiode

USA . 1,944 parts In-Stock

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1,944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,592 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,592

$1.000

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Parana Technologies

USA . 26 parts In-Stock

1+ parts

$2.149

100+ parts

-

1k+ parts

$2.663

10k+ parts

-

26

$2.149

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$2.663

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DigiPath Technology Company

USA . 1,343 parts In-Stock

1+ parts

$2.367

100+ parts

$2.177

1k+ parts

-

10k+ parts

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1,343

$2.367

$2.177

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ChromeModa Solutions

Germany . 2,458 parts In-Stock

1+ parts

$2.415

100+ parts

$1.980

1k+ parts

-

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2,458

$2.415

$1.980

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IDEA Electronic Components Group

UK . 1,724 parts In-Stock

1+ parts

$2.415

100+ parts

-

1k+ parts

$2.174

10k+ parts

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1,724

$2.415

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$2.174

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AZTECH Wire

Italy . 488 parts In-Stock

1+ parts

$8.960

100+ parts

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488

$8.960

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Corphita

USA . 2,828 parts In-Stock

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2,828

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Overview

Unlock the power of reliable memory storage with the TBP24S81-55JP4 OTP ROM by Texas Instruments. Crafted with precision and quality in mind, this product offers unparalleled performance and durability. Perfect for a wide range of applications, this OTP ROM provides customers with the peace of mind knowing their data is safe and secure. Trust Texas Instruments to deliver cutting-edge technology that meets your needs while providing exceptional value and benefits. Choose the TBP24S81-55JP4 for superior performance and reliability that you can count on.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent stability and reliability, making this OTP ROM suitable for various applications where durability is important.

No. of Terminals: 18

Having 18 terminals allows for more efficient data transfer and connectivity options, making it a versatile choice for different system configurations.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance, making it easier to integrate this OTP ROM into existing systems.

Organization: 2KX4

The 2KX4 organization offers a balanced combination of capacity and performance, providing optimal storage and access capabilities for a wide range of data.

Technology: TTL

TTL technology ensures fast and reliable data processing, making this OTP ROM a dependable choice for applications that require high-speed data retrieval.

Maximum Access Time: 55 ns

With a maximum access time of 55 ns, this OTP ROM offers quick response times, ensuring efficient data access and processing for optimal system performance.

Technical Specifications

OTP ROM TBP24S81-55JP4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-XDIP-T18

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX4

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Maximum Supply Current:

175 mA

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP24S81-55JP4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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