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SNJ54BCT8240AFK

Texas Instruments

SNJ54BCT8240AFK by Texas Instruments

SNJ54BCT8240AFK by Texas Instruments is a 4-bit bus driver with 9ns propagation delay, suitable for military applications. It features 3-STATE output characteristics, operates at temperatures from -55 to 125°C, and has a max supply voltage of 5.5V. The chip carrier package style with ceramic body material makes it ideal for high-reliability environments requiring fast signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,633 parts In-Stock

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5,633

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Digiode

USA . 1,579 parts In-Stock

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1,579

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Distributors (Availability)

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Andel Nordic

Denmark . 3,224 parts In-Stock

1+ parts

$3.527

100+ parts

-

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$3.386

10k+ parts

$3.386

3,224

$3.527

-

$3.386

$3.386

AZTECH Wire

Italy . 802 parts In-Stock

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$9.402

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802

$9.402

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One Stop Electronics

USA . 1,224 parts In-Stock

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$27.000

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1,224

$27.000

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Parana Technologies

USA . 1,706 parts In-Stock

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$29.567

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$60.737

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1,706

$29.567

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$60.737

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DigiPath Technology Company

USA . 1,078 parts In-Stock

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$32.557

100+ parts

$29.952

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1,078

$32.557

$29.952

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ChromeModa Solutions

Germany . 2,823 parts In-Stock

1+ parts

$33.221

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$27.241

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2,823

$33.221

$27.241

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

1+ parts

$33.221

100+ parts

$31.560

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$29.899

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2,212

$33.221

$31.560

$29.899

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Corphita

USA . 4,653 parts In-Stock

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Microchip USA

USA . 2,615 parts In-Stock

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Overview

Enhance your electronic designs with the SNJ54BCT8240AFK by Texas Instruments. Crafted with precision and reliability, this bus driver & transceiver is a must-have for your projects. With a MIL-PRF-38535 screening level and superior performance, this chip carrier package ensures optimal functionality. Whether you're working on military-grade applications or high-speed data transmission, this 4-bit device offers unmatched value and efficiency. Trust Texas Instruments to deliver top-notch quality and innovation in every product, making your projects shine brighter than ever before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 9 ns

Fast propagation delay allows for quick data transmission, making this product efficient.

Surface Mount: YES

Easy to mount on PCBs, simplifying the assembly process.

No. of Functions: 2

Multiple functions in a single package provide cost savings and space efficiency.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes this product suitable for a wide range of operating conditions.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance of speed and power efficiency, enhancing overall performance.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT8240AFK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e0

Length:

11.43 mm

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

52 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Width:

11.43 mm

Trade Compliance

SNJ54BCT8240AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-477-9673, 5962014779673

NIIN

014779673

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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