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SNJ54126W-10

Texas Instruments

SNJ54126W-10 by Texas Instruments

SNJ54126W-10 by Texas Instruments is a 4-bit bus driver with 3-STATE output, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 18ns and can handle load capacitance up to 50pF. This rectangular flatpack package is ideal for military-grade applications requiring reliable TTL technology in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,725 parts In-Stock

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8,725

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Digiode

USA . 1,619 parts In-Stock

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1,619

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Distributors (Availability)

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Andel Nordic

Denmark . 402 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

$10.608

10k+ parts

$10.608

402

$11.050

-

$10.608

$10.608

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$19.368

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386

$19.368

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Parana Technologies

USA . 312 parts In-Stock

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$25.847

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-

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$26.445

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312

$25.847

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$26.445

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DigiPath Technology Company

USA . 935 parts In-Stock

1+ parts

$28.461

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935

$28.461

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ChromeModa Solutions

Germany . 4,413 parts In-Stock

1+ parts

$29.042

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$23.814

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4,413

$29.042

$23.814

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IDEA Electronic Components Group

UK . 276 parts In-Stock

1+ parts

$29.042

100+ parts

$27.590

1k+ parts

$26.138

10k+ parts

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276

$29.042

$27.590

$26.138

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One Stop Electronics

USA . 1,491 parts In-Stock

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$53.000

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1,491

$53.000

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Corphita

USA . 1,169 parts In-Stock

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1,169

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Overview

Enhance the efficiency of your electronic projects with the high-quality SNJ54126W-10 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability. Perfect for a wide range of applications, this product provides seamless integration and smooth operation. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SNJ54126W-10, delivering exceptional results while ensuring maximum customer satisfaction. Upgrade your projects today with this top-of-the-line component.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the components inside, making the product reliable for long-term use.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage compatibility makes it easy to integrate into existing systems.

Propagation Delay (tpd): 18 ns

Fast propagation delay ensures quick data transmission, ideal for time-sensitive applications.

Output Characteristics: 3-STATE

Allows for high impedance output state, enhancing flexibility in the system design.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making the product efficient.

Technical Specifications

Bus Driver & Transceivers SNJ54126W-10 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.29 mm

Trade Compliance

SNJ54126W-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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