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SNJ54126J

Texas Instruments

SNJ54126J by Texas Instruments

SNJ54126J by Texas Instruments is a 4-function bus driver with 3-STATE output, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 18ns and can handle load capacitance up to 50pF. This MILITARY-grade TTL device is ideal for applications requiring high-speed signal transmission in harsh environments.

Median Price

$8.929

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Freelance Electronics

USA . 1 parts In-Stock

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Digiode

USA . 4,703 parts In-Stock

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Vyrian

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Electronics Depot

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Resion

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Mil-Aero Solutions, Inc.

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Sunrise Surplus Inc.

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Electronic Expediters

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First Choice Components Inc.

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Andel Nordic

Denmark . 455 parts In-Stock

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$10.275

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$9.864

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AZTECH Wire

Italy . 685 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

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ChromeModa Solutions

Germany . 1,612 parts In-Stock

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One Stop Electronics

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Overview

Enhance your electronic designs with the reliable SNJ54126J by Texas Instruments. Crafted with precision using MIL-PRF-38535 screening level materials, this 4-function bus driver & transceiver offers unparalleled quality and performance. Perfect for a wide range of applications, this TTL technology device boasts a true output polarity and fast propagation delay of just 18 ns. With a compact and durable package design, this versatile component provides customers with exceptional value and reliability, making it a must-have for any electronics project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and reliability in harsh environments, making it suitable for use in buses and other transportation vehicles.

No. of Functions: 4

With multiple functions, this product can handle various tasks efficiently, reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration and compatibility with existing systems easier.

Propagation Delay (tpd): 18 ns

Low propagation delay ensures fast signal transmission, which is essential for real-time communication in bus systems.

Temperature Grade: MILITARY

Built to military standards, this product can withstand extreme temperatures and rugged conditions commonly encountered in military and transportation applications.

Technical Specifications

Bus Driver & Transceivers SNJ54126J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Control Type:

ENABLE HIGH

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54126J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-086-0290, 5962010860290

NIIN

010860290

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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