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SNJ54366AJ-00

Texas Instruments

SNJ54366AJ-00 by Texas Instruments

SNJ54366AJ-00 by Texas Instruments is a 6-bit bus driver with 16 terminals, operating at a supply voltage of 4.5V to 5.5V. It features a propagation delay of 16ns and output polarity is inverted, suitable for military-grade applications requiring TTL technology and a max temperature of 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,390 parts In-Stock

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6,390

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Digiode

USA . 2,324 parts In-Stock

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2,324

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Distributors (Availability)

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AZTECH Wire

Italy . 618 parts In-Stock

1+ parts

$10.396

100+ parts

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618

$10.396

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Andel Nordic

Denmark . 220 parts In-Stock

1+ parts

$10.642

100+ parts

-

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$10.216

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$10.216

220

$10.642

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$10.216

$10.216

One Stop Electronics

USA . 1,388 parts In-Stock

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$17.000

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1,388

$17.000

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Parana Technologies

USA . 1,317 parts In-Stock

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$28.162

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$44.379

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1,317

$28.162

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$44.379

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DigiPath Technology Company

USA . 1,213 parts In-Stock

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$31.010

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1,213

$31.010

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

1+ parts

$31.643

100+ parts

$30.061

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$28.479

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1,642

$31.643

$30.061

$28.479

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ChromeModa Solutions

Germany . 821 parts In-Stock

1+ parts

$31.643

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$25.947

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821

$31.643

$25.947

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Corphita

USA . 1,782 parts In-Stock

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1,782

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Overview

Enhance your electronic projects with the SNJ54366AJ-00 by Texas Instruments, a top-tier manufacturer known for delivering quality components. As a Bus Driver & Transceiver, this product offers reliable performance and seamless integration with various systems. With a MILITARY-grade temperature grade and INVERTED output polarity, the SNJ54366AJ-00 ensures optimal functionality in challenging environments. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the unmatched value and benefits this exceptional product brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability for long-term use.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, making it compatible with most systems and easy to integrate.

Propagation Delay (tpd): 16 ns

Fast propagation delay ensures quick response times and efficient data transmission.

Output Characteristics: 3-STATE

3-state output allows for high impedance, improving flexibility in bus configurations.

Technology: TTL

Uses TTL technology which is known for its robustness and reliability in communication systems.

Technical Specifications

Bus Driver & Transceivers SNJ54366AJ-00 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54366AJ-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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