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SNJ54365AW-00

Texas Instruments

SNJ54365AW-00 by Texas Instruments

SNJ54365AW-00 by Texas Instruments is a 6-bit bus driver with 3-STATE output, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 22ns and can handle load capacitance up to 50pF. This flatpack package is ideal for military-grade applications requiring reliable TTL technology in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,556 parts In-Stock

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3,556

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Vyrian

USA . 3,120 parts In-Stock

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3,120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 164 parts In-Stock

1+ parts

$3.567

100+ parts

-

1k+ parts

$3.424

10k+ parts

$3.424

164

$3.567

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$3.424

$3.424

AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$15.061

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376

$15.061

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Parana Technologies

USA . 2,314 parts In-Stock

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$17.448

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$17.648

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2,314

$17.448

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$17.648

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DigiPath Technology Company

USA . 816 parts In-Stock

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$19.213

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816

$19.213

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ChromeModa Solutions

Germany . 3,527 parts In-Stock

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$19.605

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$16.076

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3,527

$19.605

$16.076

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$19.605

100+ parts

$18.625

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$17.644

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266

$19.605

$18.625

$17.644

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One Stop Electronics

USA . 806 parts In-Stock

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$36.000

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806

$36.000

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Corphita

USA . 3,645 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the SNJ54365AW-00 from Texas Instruments. Crafted with precision using top-notch materials, this bus driver and transceiver guarantees unparalleled quality and reliability. Ideal for a wide range of applications, this product offers customers exceptional value by providing fast propagation delay, true output polarity, and military-grade temperature performance. Elevate your projects with the unmatched benefits and advantages of the SNJ54365AW-00, where cutting-edge technology meets exceptional performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ensures durability and reliability in harsh operating environments.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards.

No. of Bits: 6

Provides sufficient data transmission capacity for bus communication.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with many systems.

Propagation Delay (tpd): 22 ns

Fast signal propagation for efficient data transmission.

Maximum Operating Temperature: 125 °C

Suitable for use in a wide range of temperature conditions.

Output Characteristics: 3-STATE

Ability to tri-state outputs for bus sharing applications.

Technology: TTL

Compatible with TTL logic systems for easy integration.

Technical Specifications

Bus Driver & Transceivers SNJ54365AW-00 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54365AW-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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