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SNJ54125W-00

Texas Instruments

SNJ54125W-00 by Texas Instruments

SNJ54125W-00 by Texas Instruments is a 4-bit bus driver with 3-STATE output, operating at -55 to 125 °C. It has a propagation delay of 18 ns and supports a load capacitance of 50 pF. Ideal for military-grade applications requiring TTL technology in a compact flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,678 parts In-Stock

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7,678

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Digiode

USA . 1,185 parts In-Stock

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1,185

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Distributors (Availability)

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Parana Technologies

USA . 1,395 parts In-Stock

1+ parts

$14.993

100+ parts

-

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$15.417

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1,395

$14.993

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$15.417

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One Stop Electronics

USA . 179 parts In-Stock

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$15.000

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-

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179

$15.000

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DigiPath Technology Company

USA . 1,350 parts In-Stock

1+ parts

$16.509

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$15.188

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1,350

$16.509

$15.188

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ChromeModa Solutions

Germany . 4,522 parts In-Stock

1+ parts

$16.846

100+ parts

$13.814

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4,522

$16.846

$13.814

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IDEA Electronic Components Group

UK . 439 parts In-Stock

1+ parts

$16.846

100+ parts

$16.004

1k+ parts

$15.161

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439

$16.846

$16.004

$15.161

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AZTECH Wire

Italy . 840 parts In-Stock

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$17.253

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840

$17.253

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Corphita

USA . 2,465 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the Texas Instruments SNJ54125W-00 Bus Driver & Transceivers. Manufactured using top-quality ceramic and glass-sealed materials, this product guarantees exceptional durability and functionality. Ideal for a wide range of applications, this 4-bit driver offers customers unmatched value by delivering fast propagation delay, true output polarity, and a military-grade temperature rating. Elevate your projects with Texas Instruments' cutting-edge technology and trust in the superior quality of the SNJ54125W-00 for all your bus driving needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement that is widely supported and easily accessible.

Propagation Delay (tpd): 18 ns

Low propagation delay ensures fast and efficient signal transmission.

Output Characteristics: 3-STATE

3-state output allows multiple devices to share the same bus line without interference.

Technology: TTL

TTL technology offers high speed and low power consumption, making the product suitable for various applications.

Technical Specifications

Bus Driver & Transceivers SNJ54125W-00 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

54 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.29 mm

Trade Compliance

SNJ54125W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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