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SNJ54AC574W

Texas Instruments

SNJ54AC574W by Texas Instruments

SNJ54AC574W by Texas Instruments is an 8-bit bus driver with a max frequency of 55MHz. It operates at a supply voltage of 3.3V and has a propagation delay of 16.5ns, making it ideal for military-grade applications requiring high-speed data transmission in harsh environments. The device features a flatpack package style, dual terminal position, and true output polarity, suitable for use in communication systems and aerospace technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,331 parts In-Stock

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3,331

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Digiode

USA . 623 parts In-Stock

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623

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Sunrise Surplus Inc.

USA . 44 parts In-Stock

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44

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Cyclops Electronics Ltd

UK . 5 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 161 parts In-Stock

1+ parts

$5.497

100+ parts

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$5.277

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$5.277

161

$5.497

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$5.277

$5.277

Parana Technologies

USA . 1,165 parts In-Stock

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$10.193

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$10.729

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1,165

$10.193

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$10.729

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DigiPath Technology Company

USA . 439 parts In-Stock

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$11.224

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$10.326

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439

$11.224

$10.326

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ChromeModa Solutions

Germany . 2,246 parts In-Stock

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$11.453

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$9.391

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$11.453

$9.391

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IDEA Electronic Components Group

UK . 1,084 parts In-Stock

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$11.453

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$10.880

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$10.308

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1,084

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$10.308

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AZTECH Wire

Italy . 270 parts In-Stock

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$19.654

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$19.654

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One Stop Electronics

USA . 449 parts In-Stock

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$26.000

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$26.000

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Ampacity Inc.

Singapore . 1,635 parts In-Stock

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$37.000

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Microchip USA

USA . 1,870 parts In-Stock

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Corphita

USA . 96 parts In-Stock

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Overview

Discover the unmatched quality and reliability of Texas Instruments with the SNJ54AC574W Bus Driver & Transceiver. Designed to meet rigorous MIL-PRF-38535 standards, this versatile component offers seamless integration and superior performance for a wide range of applications. With 3-STATE output characteristics and a TRUE polarity, this product ensures efficient signal transmission with minimal power consumption. Trust in Texas Instruments for cutting-edge technology, exceptional value, and unparalleled benefits for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage for efficient operation and power consumption.

Maximum Frequency At Nominal Supply: 55000000 Hz

High-frequency capability allows for fast data transmission and response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for efficient bus driver applications.

Technical Specifications

Bus Driver & Transceivers SNJ54AC574W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

55000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Trade Compliance

SNJ54AC574W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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