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SN74LVTH16240DLRG4

Texas Instruments

SN74LVTH16240DLRG4 by Texas Instruments

SN74LVTH16240DLRG4 by Texas Instruments is a 48-terminal bus driver with 3.5ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 3.3V and has a max power supply current of 5mA. With surface mount capability and inverted output polarity, it offers efficient signal transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

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3,495

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Vyrian

USA . 3,234 parts In-Stock

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3,234

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Distributors (Availability)

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Andel Nordic

Denmark . 1,944 parts In-Stock

1+ parts

$3.786

100+ parts

-

1k+ parts

$3.635

10k+ parts

$3.635

1,944

$3.786

-

$3.635

$3.635

One Stop Electronics

USA . 1,185 parts In-Stock

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$15.000

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1,185

$15.000

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AZTECH Wire

Italy . 787 parts In-Stock

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$15.659

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787

$15.659

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Parana Technologies

USA . 1,229 parts In-Stock

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$22.505

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$23.175

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1,229

$22.505

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$23.175

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DigiPath Technology Company

USA . 1,882 parts In-Stock

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$24.780

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1,882

$24.780

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ChromeModa Solutions

Germany . 1,874 parts In-Stock

1+ parts

$25.286

100+ parts

$20.735

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1,874

$25.286

$20.735

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IDEA Electronic Components Group

UK . 161 parts In-Stock

1+ parts

$25.286

100+ parts

$24.022

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$22.757

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161

$25.286

$24.022

$22.757

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Corphita

USA . 2,138 parts In-Stock

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Microchip USA

USA . 930 parts In-Stock

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930

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Overview

Enhance the performance of your electronic devices with the Texas Instruments SN74LVTH16240DLRG4 Bus Driver & Transceivers. Known for their high-quality products, Texas Instruments delivers reliable solutions for various applications. This versatile product offers fast propagation delay and 3-state output characteristics, making it ideal for industrial use. With a small outline package style and dual terminal position, this bus driver provides ease of installation and operation. Upgrade your systems with the SN74LVTH16240DLRG4 and experience seamless communication and efficient functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 3.5 ns

Delivers fast signal transmission, ensuring efficient communication within the bus system.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and enabling streamlined manufacturing processes.

No. of Functions: 4

Offers multiple functions in a single component, reducing the overall complexity of the circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage, ensuring compatibility with a wide range of systems.

Output Characteristics: 3-STATE

Provides the ability to output a high impedance state, allowing for efficient bus sharing among multiple devices.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in elevated temperature environments, making it suitable for industrial applications.

Technology: BICMOS

Combines the benefits of both bipolar and CMOS technologies, offering low power consumption, high speed, and robustness.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16240DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74LVTH16240DLRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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