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SN74LVT8986PM

Texas Instruments

SN74LVT8986PM by Texas Instruments

SN74LVT8986PM by Texas Instruments is a 64-terminal IC with a supply voltage range of 2.7V to 3.6V, operating temperature from -40°C to 85°C, and BICMOS technology. It is ideal for industrial applications requiring a microprocessor circuit in a square flatpack package with gull wing terminals.

Median Price

$11.027

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 655 parts In-Stock

1+ parts

$5.620

100+ parts

-

1k+ parts

-

10k+ parts

-

655

$5.620

-

-

-

Texas Instruments

USA . 8,123 parts In-Stock

1+ parts

$11.027

100+ parts

$9.632

1k+ parts

$6.643

10k+ parts

-

8,123

$11.027

$9.632

$6.643

-

Mouser Electronics

USA . 179 parts In-Stock

1+ parts

$21.190

100+ parts

$12.600

1k+ parts

$12.400

10k+ parts

-

179

$21.190

$12.600

$12.400

-

Arrow

USA . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.919

10k+ parts

-

320

-

-

$8.919

-

Rochester

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$10.980

1k+ parts

$9.830

10k+ parts

$9.250

315

-

$10.980

$9.830

$9.250

DigiKey

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$14.450

1k+ parts

-

10k+ parts

-

315

-

$14.450

-

-

Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$13.725

1k+ parts

$12.287

10k+ parts

$11.563

300

-

$13.725

$12.287

$11.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,562 parts In-Stock

1+ parts

$0.845

100+ parts

-

1k+ parts

-

10k+ parts

-

3,562

$0.845

-

-

-

Vyrian

USA . 6,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,415

-

-

-

-

DigiKey Marketplace

USA . 516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

516

-

-

-

-

Chip Stock

USA . 229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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229

-

-

-

-

LWI Electronics Inc

India . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,243 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

3,243

$0.800

-

-

-

Parana Technologies

USA . 538 parts In-Stock

1+ parts

$60.540

100+ parts

-

1k+ parts

-

10k+ parts

-

538

$60.540

-

-

-

DigiPath Technology Company

USA . 1,544 parts In-Stock

1+ parts

$66.663

100+ parts

$61.330

1k+ parts

-

10k+ parts

-

1,544

$66.663

$61.330

-

-

ChromeModa Solutions

Germany . 4,661 parts In-Stock

1+ parts

$68.023

100+ parts

$55.779

1k+ parts

-

10k+ parts

-

4,661

$68.023

$55.779

-

-

IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$68.023

100+ parts

$64.622

1k+ parts

$61.221

10k+ parts

-

2,292

$68.023

$64.622

$61.221

-

Corohmni

South Africa . 363 parts In-Stock

1+ parts

$76.680

100+ parts

-

1k+ parts

-

10k+ parts

-

363

$76.680

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Perfect Parts

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

-

-

-

-

Overview

Discover the unparalleled quality and reliability of the SN74LVT8986PM by Texas Instruments, a leading manufacturer in the industry. This versatile peripheral IC offers a wide range of applications in microprocessor circuits, ensuring optimal performance and efficiency. With a durable plastic/epoxy body and advanced BICMOS technology, this product delivers exceptional value and benefits to customers. Experience seamless integration and high functionality with the SN74LVT8986PM, setting new standards in industrial-grade components. Trust Texas Instruments for cutting-edge solutions that drive innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, providing flexibility in power requirements for different applications.

Package Shape: SQUARE

Square package shape helps in optimizing PCB layout and space utilization.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures reliable performance of the product.

No. of Terminals: 64

Ample number of terminals allow for connectivity to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enhances thermal performance and enables high-density PCB layouts.

Minimum Supply Voltage: 2.7 V

Supports a low minimum supply voltage, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable operation in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures, making it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and reliable connections.

Maximum Seated Height: 1.6 mm

Low seated height saves space and enables compact designs.

Width: 10 mm

Compact width allows for efficient use of PCB real estate.

Maximum Time At Peak Reflow Temperature (s): 30

Supports quick and efficient reflow soldering process during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper bonding of components during assembly.

Length: 10 mm

Compact length enables space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides advanced computational capabilities for various applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form allows for easy inspection and rework during manufacturing.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and miniaturization of PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates that the product has moderate sensitivity to moisture, requiring standard handling procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74LVT8986PM attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SN74LVT8986PM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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