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SN74LV08ATPWREP

Texas Instruments

SN74LV08ATPWREP by Texas Instruments

SN74LV08ATPWREP by Texas Instruments is a logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 3.3V, has a propagation delay of 16ns, and can handle a load capacitance of 50pF. This IC is suitable for industrial applications requiring fast signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,643 parts In-Stock

1+ parts

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4,643

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Digiode

USA . 1,413 parts In-Stock

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1,413

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Distributors (Availability)

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Microchip USA

USA . 1,897 parts In-Stock

1+ parts

$5.672

100+ parts

-

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1,897

$5.672

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Parana Technologies

USA . 763 parts In-Stock

1+ parts

$12.529

100+ parts

-

1k+ parts

$12.977

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763

$12.529

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$12.977

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DigiPath Technology Company

USA . 1,704 parts In-Stock

1+ parts

$13.795

100+ parts

$12.692

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1,704

$13.795

$12.692

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ChromeModa Solutions

Germany . 6,496 parts In-Stock

1+ parts

$14.077

100+ parts

$11.543

1k+ parts

-

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6,496

$14.077

$11.543

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

1+ parts

$14.077

100+ parts

$13.373

1k+ parts

$12.669

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2,042

$14.077

$13.373

$12.669

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AZTECH Wire

Italy . 369 parts In-Stock

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$19.046

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369

$19.046

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One Stop Electronics

USA . 868 parts In-Stock

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$64.000

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868

$64.000

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Corphita

USA . 3,605 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LV08ATPWREP by Texas Instruments, a high-quality logic gate that delivers reliable performance and precision. Manufactured by industry leader Texas Instruments, this versatile component is ideal for a wide range of applications in various industries. With its advanced technology and durable construction, this logic gate ensures efficient operation and seamless integration. Bring value to your projects with the SN74LV08ATPWREP and experience the benefits of superior quality and performance that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 16 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage, making it compatible with common power supplies.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, providing stability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates SN74LV08ATPWREP attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LV08ATPWREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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