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SN74HCU7204PWRE4

Texas Instruments

SN74HCU7204PWRE4 by Texas Instruments

SN74HCU7204PWRE4 by Texas Instruments is a logic gate with 2 functions, 20 ns propagation delay at 5V. It has a small outline package and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring fast signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,280 parts In-Stock

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6,280

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Digiode

USA . 2,292 parts In-Stock

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2,292

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Distributors (Availability)

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Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

$12.684

100+ parts

-

1k+ parts

$13.148

10k+ parts

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1,635

$12.684

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$13.148

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$13.967

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2,337

$13.967

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IDEA Electronic Components Group

UK . 2,170 parts In-Stock

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$14.252

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$13.539

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$12.827

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2,170

$14.252

$13.539

$12.827

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ChromeModa Solutions

Germany . 729 parts In-Stock

1+ parts

$14.252

100+ parts

$11.687

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729

$14.252

$11.687

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One Stop Electronics

USA . 1,538 parts In-Stock

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$16.000

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1,538

$16.000

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AZTECH Wire

Italy . 802 parts In-Stock

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$19.541

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802

$19.541

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Component Stockers USA

USA . 248 parts In-Stock

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$99.990

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248

$99.990

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Corphita

USA . 2,935 parts In-Stock

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Microchip USA

USA . 471 parts In-Stock

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Overview

Enhance your electronic projects with the SN74HCU7204PWRE4 by Texas Instruments, a top-notch logic gates component that guarantees exceptional quality and reliability. With a wide range of applications in various industries, this product offers unmatched value and benefits to customers looking for cutting-edge technology. Trust in the expertise of Texas Instruments and experience the advantages of using the SN74HCU7204PWRE4 for your next project. Upgrade your electronics with this high-performance component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 20 ns

The low propagation delay ensures fast signal processing and high-speed operation.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuits.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage of 5V, compatible with many electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal processing and compatibility with various components.

Power Supplies (V): 2/6

Supports a range of power supply voltages, providing flexibility in different system configurations.

No. of Terminals: 8

Sufficient terminals for connectivity and interface with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving package design for efficient PCB layout and integration.

Maximum I (ol): 0.02 Amp

Low output current ensures safe operation and prevents overheating of the device.

Propagation Delay (tpd): 100 ns

Predictable propagation delay for accurate timing and control in digital circuits.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications and harsh environments.

Minimum Operating Temperature: -40 °C

Operates reliably in low-temperature conditions without performance degradation.

Terminal Position: DUAL

Dual terminal position for easy installation and secure connection in the circuit.

Maximum Seated Height: 1.2 mm

Low profile design for compact and space-constrained applications.

Width: 3 mm

Narrow width for efficient PCB routing and space-saving in electronic designs.

Minimum Supply Voltage (Vsup): 2 V

Supports low supply voltage operation for energy-efficient applications.

Length: 4.4 mm

Compact length for space-saving integration and efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for reliability and performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity in digital circuits.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure attachment to the PCB.

Packing Method: TR

Tape and reel packaging for convenient handling and automated assembly processes.

Terminal Pitch: 0.65 mm

Small terminal pitch for high-density mounting and compact PCB design.

Maximum Supply Voltage (Vsup): 6 V

Supports a maximum supply voltage of 6V for flexibility in different voltage requirements.

Technical Specifications

Logic Gates SN74HCU7204PWRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.02 Amp

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

SN74HCU7204PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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