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SN74HCU04NSRG4

Texas Instruments

SN74HCU04NSRG4 by Texas Instruments

SN74HCU04NSRG4 by Texas Instruments is a CMOS logic gate with 6 functions, 20 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for applications requiring fast signal processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,944 parts In-Stock

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8,944

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Digiode

USA . 513 parts In-Stock

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513

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 748 parts In-Stock

1+ parts

$13.197

100+ parts

-

1k+ parts

$13.703

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748

$13.197

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$13.703

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DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

$14.531

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-

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342

$14.531

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$14.828

100+ parts

$14.087

1k+ parts

$13.345

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-

1,888

$14.828

$14.087

$13.345

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ChromeModa Solutions

Germany . 954 parts In-Stock

1+ parts

$14.828

100+ parts

$12.159

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954

$14.828

$12.159

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AZTECH Wire

Italy . 721 parts In-Stock

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$17.212

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721

$17.212

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One Stop Electronics

USA . 432 parts In-Stock

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$62.000

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432

$62.000

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Microchip USA

USA . 4,622 parts In-Stock

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Corphita

USA . 1,151 parts In-Stock

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Overview

Enhance your electronic projects with the SN74HCU04NSRG4 logic gates from Texas Instruments. Known for their superior quality and reliability, Texas Instruments products are trusted by professionals worldwide. Ideal for a wide range of applications, these logic gates offer fast propagation delay at a nominal supply voltage of 5V. With a compact package style and high performance capabilities, this product provides exceptional value and efficiency to customers looking to optimize their circuit designs. Choose Texas Instruments for cutting-edge technology that delivers unmatched benefits and advantages.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Propagation Delay At Nominal Supply: 20 ns

The low propagation delay ensures fast operation and accurate output timing, making it suitable for high-speed logic applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes it compatible with a wide range of systems and easy to integrate into existing designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Technical Specifications

Logic Gates SN74HCU04NSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74HCU04NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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