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SN74HCT08DE4

Texas Instruments

SN74HCT08DE4 by Texas Instruments

SN74HCT08DE4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 5V, with a propagation delay of 30ns. This small outline package is ideal for industrial applications requiring fast signal processing.

Median Price

$0.629

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.629

100+ parts

-

1k+ parts

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10k+ parts

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870

$0.629

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Chip Stock

USA . 10,590 parts In-Stock

1+ parts

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10,590

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Vyrian

USA . 8,308 parts In-Stock

1+ parts

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8,308

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Digiode

USA . 2,662 parts In-Stock

1+ parts

-

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2,662

-

-

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LWI Electronics Inc

India . 80 parts In-Stock

1+ parts

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 549 parts In-Stock

1+ parts

$14.632

100+ parts

-

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549

$14.632

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Parana Technologies

USA . 1,293 parts In-Stock

1+ parts

$20.355

100+ parts

-

1k+ parts

$20.377

10k+ parts

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1,293

$20.355

-

$20.377

-

DigiPath Technology Company

USA . 2 parts In-Stock

1+ parts

$22.414

100+ parts

$20.620

1k+ parts

-

10k+ parts

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2

$22.414

$20.620

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-

ChromeModa Solutions

Germany . 5,109 parts In-Stock

1+ parts

$22.871

100+ parts

$18.754

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5,109

$22.871

$18.754

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IDEA Electronic Components Group

UK . 309 parts In-Stock

1+ parts

$22.871

100+ parts

$21.727

1k+ parts

$20.584

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309

$22.871

$21.727

$20.584

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Ampacity Inc.

Singapore . 934 parts In-Stock

1+ parts

$34.000

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934

$34.000

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One Stop Electronics

USA . 1,638 parts In-Stock

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$53.000

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1,638

$53.000

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Corphita

USA . 4,610 parts In-Stock

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4,610

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Continental Prestige Electronics

USA . 2,089 parts In-Stock

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Argo Parts USA

USA . 1,838 parts In-Stock

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Microchip USA

USA . 1,191 parts In-Stock

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1,191

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Overview

Unlock the power of seamless logic operations with the SN74HCT08DE4 by Texas Instruments. Renowned for its top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this logic gate. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. With fast propagation delays and low power consumption, the SN74HCT08DE4 is perfect for industrial settings where precision and efficiency are paramount. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Propagation Delay at Nominal Supply: 30 ns

Fast signal processing speed, ideal for high-speed circuits.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Versatile chip with multiple logic functions, reducing the need for additional components.

No. of Inputs: 2

Simple and straightforward to use, suitable for basic logic operations.

Package Shape: RECTANGULAR

Standard shape, easy to integrate into existing designs.

Nominal Supply Voltage: 5V

Compatible with common power sources, ensuring easy integration.

Load Capacitance: 50 pF

Able to drive moderate loads, suitable for a wide range of applications.

Power Supplies: 5V

Consistent power distribution, ensuring reliable performance.

No. of Terminals: 14

Sufficient terminals for connecting to other components or circuits.

Package Style (Meter): SMALL OUTLINE

Compact size, ideal for space-constrained applications.

Maximum I (ol): 4 Amp

High output current capability, suitable for driving larger loads.

Propagation Delay: 30 ns

Low delay time, ensuring quick response to input signals.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in cold environments, suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish, ensuring long-term reliability.

Terminal Position: DUAL

Allows for flexible placement and connectivity options.

Maximum Seated Height: 1.75 mm

Low profile design, suitable for space-sensitive applications.

Width: 3.9 mm

Compact width, saving space on the circuit board.

Minimum Supply Voltage: 4.5V

Lower voltage operation, conserving power and reducing heat dissipation.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during soldering, ensuring robust construction.

Length: 8.65 mm

Standard length, compatible with various circuit board layouts.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with wide temperature ranges.

Technology: CMOS

Low power consumption and high noise immunity, ideal for energy-efficient designs.

Terminal Form: GULL WING

Easy to solder and mount, ensuring reliable connections.

Packing Method: TUBE

Secure packaging for safe transportation and storage.

Terminal Pitch: 1.27 mm

Standard pitch, compatible with common connector types.

Maximum Supply Voltage: 5.5V

Can handle higher voltage spikes, ensuring robust performance.

Maximum Power Supply Current (ICC): 0.02 mA

Low power consumption, ideal for battery-operated devices.

Technical Specifications

Logic Gates SN74HCT08DE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HCT08DE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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