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SN74GTL16616DL

Texas Instruments

SN74GTL16616DL by Texas Instruments

SN74GTL16616DL by Texas Instruments is a 17-bit bus driver with GTL & LVTTL translation, operating at 3.3V nominal voltage. It features a propagation delay of 6.7ns, 3-STATE output characteristics, and supports independent control applications. Ideal for bidirectional data transmission in industrial settings with a temperature range of -40 to 85°C.

Median Price

$11.750

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 829 parts In-Stock

1+ parts

-

100+ parts

$10.170

1k+ parts

$9.100

10k+ parts

$8.570

829

-

$10.170

$9.100

$8.570

DigiKey

USA . 829 parts In-Stock

1+ parts

-

100+ parts

$11.750

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829

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$11.750

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Verical

USA . 783 parts In-Stock

1+ parts

-

100+ parts

$12.713

1k+ parts

$11.375

10k+ parts

$10.713

783

-

$12.713

$11.375

$10.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,414 parts In-Stock

1+ parts

$10.735

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1,414

$10.735

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Vyrian

USA . 7,363 parts In-Stock

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7,363

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Bristol Electronics

USA . 1,000 parts In-Stock

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1,000

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Lighthouse Electronics, Inc.

USA . 211 parts In-Stock

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211

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Resion

USA . 86 parts In-Stock

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R&J Components

USA . 13 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,729 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

$1.512

10k+ parts

$1.512

2,729

$1.575

-

$1.512

$1.512

Corphita

USA . 3,848 parts In-Stock

1+ parts

$10.170

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3,848

$10.170

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Parana Technologies

USA . 1,132 parts In-Stock

1+ parts

$27.076

100+ parts

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1k+ parts

$31.986

10k+ parts

-

1,132

$27.076

-

$31.986

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DigiPath Technology Company

USA . 312 parts In-Stock

1+ parts

$29.815

100+ parts

$27.429

1k+ parts

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312

$29.815

$27.429

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ChromeModa Solutions

Germany . 2,407 parts In-Stock

1+ parts

$30.423

100+ parts

$24.947

1k+ parts

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2,407

$30.423

$24.947

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IDEA Electronic Components Group

UK . 1,284 parts In-Stock

1+ parts

$30.423

100+ parts

$28.902

1k+ parts

$27.381

10k+ parts

-

1,284

$30.423

$28.902

$27.381

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A-Z Elektronik GmbH

Germany . 6,755 parts In-Stock

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6,755

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Kepictronics

USA . 829 parts In-Stock

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829

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Microchip USA

USA . 110 parts In-Stock

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110

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Overview

Unlock the power of seamless data transmission with the SN74GTL16616DL by Texas Instruments. Designed with precision and reliability in mind, this bus driver & transceiver boasts unmatched quality and performance. Ideal for a wide range of applications, this product ensures fast propagation delay and efficient translation between GTL & LVTTL signals. With a compact design and dual-terminal position, it offers convenience and flexibility for industrial-grade operations. Experience the value of smooth signal transmission and maximize your system's efficiency with the SN74GTL16616DL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.7 ns

Fast propagation delay allows for quick and efficient data transmission, making the product ideal for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design, perfect for compact electronic devices.

No. of Bits: 17

Provides a wide range of communication options and compatibility with various systems.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient performance and power consumption.

Load Capacitance (CL): 50 pF

Designed to work effectively with a standard load capacitance, ensuring stability in operation.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide temperature range, ensuring reliable operation in harsh conditions.

Maximum Power Supply Current (ICC): 5 mA

Low power consumption, making the product energy-efficient and cost-effective to use.

Technical Specifications

Bus Driver & Transceivers SN74GTL16616DL attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TRANSLATES BETWEEN GTL/GTL+ SIGNAL LEVELS AND LVTTL LOGIC LEVELS

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTL/TVC

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

17

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTL & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74GTL16616DL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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