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SN74ALVC3641-10PCB

Texas Instruments

SN74ALVC3641-10PCB by Texas Instruments

SN74ALVC3641-10PCB by Texas Instruments is a 1Kx36 CMOS FIFO memory with 10ns cycle time, operating at 3.3V. It features parallel operation, GULL WING terminals, and low profile flatpack package style. Ideal for applications requiring fast synchronous data transfer in commercial temperature environments.

Median Price

$14.270

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 419 parts In-Stock

1+ parts

-

100+ parts

$12.350

1k+ parts

$11.050

10k+ parts

$10.400

419

-

$12.350

$11.050

$10.400

DigiKey

USA . 419 parts In-Stock

1+ parts

-

100+ parts

$14.270

1k+ parts

-

10k+ parts

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419

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$14.270

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-

Verical

USA . 318 parts In-Stock

1+ parts

-

100+ parts

$15.438

1k+ parts

$13.813

10k+ parts

$13.000

318

-

$15.438

$13.813

$13.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,677 parts In-Stock

1+ parts

$13.034

100+ parts

-

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-

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3,677

$13.034

-

-

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Vyrian

USA . 8,471 parts In-Stock

1+ parts

-

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8,471

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DigiKey Marketplace

USA . 419 parts In-Stock

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419

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LWI Electronics Inc

India . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,739 parts In-Stock

1+ parts

$3.055

100+ parts

-

1k+ parts

$3.570

10k+ parts

-

1,739

$3.055

-

$3.570

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ChromeModa Solutions

Germany . 5,512 parts In-Stock

1+ parts

$3.433

100+ parts

$2.815

1k+ parts

-

10k+ parts

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5,512

$3.433

$2.815

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

1+ parts

$3.433

100+ parts

-

1k+ parts

$3.090

10k+ parts

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2,132

$3.433

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$3.090

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Corphita

USA . 3,096 parts In-Stock

1+ parts

$12.348

100+ parts

-

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3,096

$12.348

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Microchip USA

USA . 373 parts In-Stock

1+ parts

$39.960

100+ parts

$39.390

1k+ parts

$39.100

10k+ parts

$38.810

373

$39.960

$39.390

$39.100

$38.810

DigiPath Technology Company

USA . 512 parts In-Stock

1+ parts

-

100+ parts

$3.095

1k+ parts

-

10k+ parts

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512

-

$3.095

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Overview

Experience seamless data transfer and efficient memory management with the Texas Instruments SN74ALVC3641-10PCB. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in every product. This FIFO device offers a wide range of applications, providing customers with a versatile solution for their data storage needs. With fast cycle times and low power consumption, this device maximizes performance while minimizing energy usage. Trust Texas Instruments to deliver cutting-edge technology that enhances your systems' capabilities and boosts productivity. Upgrade to the SN74ALVC3641-10PCB today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the components inside, ensuring reliability and longevity of the product.

Cycle Time: 10 ns

The fast cycle time of 10 ns allows for quick processing and efficient data retrieval, making this FIFO a suitable choice for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and readily available, making it easy to integrate this FIFO into existing systems without the need for additional power sources.

No. of Terminals: 120

With 120 terminals, this FIFO offers ample connectivity options for interfacing with other components or systems, allowing for versatile integration in various applications.

Memory Width: 36

The 36-bit memory width allows for efficient data storage and retrieval, making this FIFO suitable for applications requiring high data throughput and processing capabilities.

Technical Specifications

FIFO SN74ALVC3641-10PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

7.5 ns

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ALVC3641-10PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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