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SN74AHCU04DGVRE4

Texas Instruments

SN74AHCU04DGVRE4 by Texas Instruments

SN74AHCU04DGVRE4 by Texas Instruments is a CMOS logic gate with 6 functions, 8 ns propagation delay at 3.3V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package suitable for surface mount applications.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 3,106 parts In-Stock

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Digiode

USA . 827 parts In-Stock

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Parana Technologies

USA . 1,112 parts In-Stock

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$9.994

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$10.556

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DigiPath Technology Company

USA . 1,522 parts In-Stock

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$11.004

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$10.124

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ChromeModa Solutions

Germany . 4,088 parts In-Stock

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$11.229

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$9.208

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

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$11.229

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$10.668

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$10.106

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AZTECH Wire

Italy . 464 parts In-Stock

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$18.128

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One Stop Electronics

USA . 304 parts In-Stock

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Microchip USA

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Corphita

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74AHCU04DGVRE4 Logic Gates. Perfect for a wide range of applications, this product offers 6 functions in a compact package, ensuring efficient performance. With a nominal supply voltage of 3.3V and a propagation delay of just 8ns, this logic gate provides fast and reliable operation. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with precision and excellence. Elevate your projects with the SN74AHCU04DGVRE4 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product durable and resistant to environmental factors, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 8 ns

With a low propagation delay at nominal supply, this product offers fast and efficient signal processing.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

No. of Functions: 6

Having 6 functions in one component increases the functionality and versatility of the product, making it suitable for complex logic operations.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a nominal supply voltage of 3.3V, making it compatible with a wide range of electronic devices and systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can efficiently handle and process signals with varying capacitance requirements.

Power Supplies (V): 2/5.5

Supports power supplies in the range of 2V to 5.5V, allowing for flexible voltage input options for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances space efficiency and makes the product suitable for compact designs.

Maximum I (ol): 8 Amp

With a maximum output current of 8 Amp, this product can drive powerful loads with ease, ensuring stable performance under high current conditions.

Propagation Delay (tpd): 12 ns

The propagation delay of 12 ns ensures quick response times for signal processing, enhancing the overall efficiency of the product.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures up to 85°C, making it suitable for industrial applications with demanding temperature conditions.

Minimum Operating Temperature: -40 °C

Can function effectively even at low temperatures down to -40°C, ensuring reliable performance in various operating environments.

Terminal Position: DUAL

Dual terminal position provides versatility in connection options, allowing for flexible installation configurations.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm ensures a compact and low-profile design, suitable for space-constrained applications.

Width: 3.6 mm

The width of 3.6 mm allows for easy integration into circuit layouts, optimizing space utilization on the board.

Minimum Supply Voltage (Vsup): 2 V

Supports a minimum supply voltage of 2V, enabling operation in low-voltage scenarios while maintaining reliable performance.

Length: 4.4 mm

The length of 4.4 mm provides a compact footprint for the product, making it suitable for designs with limited space constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature performance ensures stable operation in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form provides a secure connection and facilitates easy soldering during installation, ensuring reliable electrical connections.

Packing Method: TR

TR packing method offers convenient handling and storage of the product during shipping and assembly processes, reducing the risk of damage.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, this product offers precise and compact terminal spacing, optimizing the PCB layout for efficient signal routing.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V, providing a wide voltage range for versatile compatibility with different power supply options.

Technical Specifications

Logic Gates SN74AHCU04DGVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

Length:

4.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.6 mm

Trade Compliance

SN74AHCU04DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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