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SN74ACT2227DW

Texas Instruments

SN74ACT2227DW by Texas Instruments

SN74ACT2227DW by Texas Instruments is a FIFO memory IC with 64x1 organization, operating at 5V. It features a cycle time of 16.67ns and max clock frequency of 22MHz, suitable for industrial applications requiring fast data storage and retrieval. With synchronous operation and output enable functionality, it offers reliable performance in various electronic systems.

Median Price

$10.730

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,615 parts In-Stock

1+ parts

-

100+ parts

$9.290

1k+ parts

$8.310

10k+ parts

$7.820

2,615

-

$9.290

$8.310

$7.820

DigiKey

USA . 2,615 parts In-Stock

1+ parts

-

100+ parts

$10.730

1k+ parts

-

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2,615

-

$10.730

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Verical

USA . 1,650 parts In-Stock

1+ parts

-

100+ parts

$11.613

1k+ parts

$10.387

10k+ parts

$9.775

1,650

-

$11.613

$10.387

$9.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 559 parts In-Stock

1+ parts

$9.804

100+ parts

-

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-

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559

$9.804

-

-

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Vyrian

USA . 2,585 parts In-Stock

1+ parts

$10.320

100+ parts

-

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10k+ parts

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2,585

$10.320

-

-

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DigiKey Marketplace

USA . 2,615 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,615

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-

-

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LWI Electronics Inc

India . 728 parts In-Stock

1+ parts

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728

-

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PC Components Company LLC

USA . 111 parts In-Stock

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111

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Bristol Electronics

USA . 44 parts In-Stock

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44

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,048 parts In-Stock

1+ parts

$2.909

100+ parts

-

1k+ parts

$3.407

10k+ parts

-

1,048

$2.909

-

$3.407

-

DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$3.203

100+ parts

$2.946

1k+ parts

-

10k+ parts

-

2,236

$3.203

$2.946

-

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ChromeModa Solutions

Germany . 4,008 parts In-Stock

1+ parts

$3.268

100+ parts

$2.680

1k+ parts

-

10k+ parts

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4,008

$3.268

$2.680

-

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

1+ parts

$3.268

100+ parts

-

1k+ parts

$2.941

10k+ parts

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1,412

$3.268

-

$2.941

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Corphita

USA . 4,847 parts In-Stock

1+ parts

$9.288

100+ parts

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4,847

$9.288

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Microchip USA

USA . 199 parts In-Stock

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199

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Perfect Parts

USA . 101 parts In-Stock

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101

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Overview

Unlock seamless data transfer and efficient memory management with the Texas Instruments SN74ACT2227DW FIFO. Crafted with precision using top-notch materials, this innovative device ensures reliable performance in industrial settings. With a synchronous operating mode and 64-bit memory density, this FIFO offers unmatched speed and accuracy. Perfect for applications requiring rapid data retrieval and storage, the SN74ACT2227DW provides a compact design and low power consumption, making it a valuable asset for your technical projects. Elevate your systems with this high-quality solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight casing for the FIFO product, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Cycle Time: 16.67 ns

Offers fast data processing and retrieval speeds, improving overall system performance.

Operating Mode: SYNCHRONOUS

Ensures synchronized data transfer, enhancing the reliability and efficiency of the FIFO product.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, compatible with most electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

Output Characteristics: 3-STATE

Allows for multiple outputs, providing flexibility in data transmission.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Maximum Clock Frequency (fCLK): 22 MHz

Supports high-speed clock frequencies, ideal for demanding data processing tasks.

Technical Specifications

FIFO SN74ACT2227DW attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

9 ns

Maximum Clock Frequency (fCLK):

22 MHz

Cycle Time:

16.67 ns

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X1

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ACT2227DW Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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