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SN74AC86PWE4

Texas Instruments

SN74AC86PWE4 by Texas Instruments

SN74AC86PWE4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 12.5 ns at 3.3V, suitable for industrial applications requiring fast response times. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,616 parts In-Stock

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5,616

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Digiode

USA . 1,139 parts In-Stock

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 398 parts In-Stock

1+ parts

$11.552

100+ parts

-

1k+ parts

$11.961

10k+ parts

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398

$11.552

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$11.961

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DigiPath Technology Company

USA . 2,033 parts In-Stock

1+ parts

$12.720

100+ parts

$11.703

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-

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2,033

$12.720

$11.703

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ChromeModa Solutions

Germany . 2,098 parts In-Stock

1+ parts

$12.980

100+ parts

$10.644

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2,098

$12.980

$10.644

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IDEA Electronic Components Group

UK . 436 parts In-Stock

1+ parts

$12.980

100+ parts

$12.331

1k+ parts

$11.682

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436

$12.980

$12.331

$11.682

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AZTECH Wire

Italy . 534 parts In-Stock

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$18.193

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534

$18.193

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One Stop Electronics

USA . 194 parts In-Stock

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$54.000

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194

$54.000

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Corphita

USA . 4,704 parts In-Stock

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Microchip USA

USA . 2,925 parts In-Stock

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2,925

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Overview

Experience seamless integration and exceptional performance with the SN74AC86PWE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality logic gates that are perfect for a wide range of applications. With a package body material of PLASTIC/EPOXY and a nominal supply voltage of 3.3V, this product offers reliability and efficiency like no other. Whether you're working on industrial automation or consumer electronics, the SN74AC86PWE4 provides the value, benefits, and advantages you need to bring your projects to life. Unlock the potential of your designs with Texas Instruments logic gates today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for compact electronic devices.

Propagation Delay At Nominal Supply: 12.5 ns

With a low propagation delay, this product ensures fast and efficient signal processing in electronic circuits.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product onto circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 4

The presence of multiple functions in a single component reduces the overall component count in a circuit, simplifying designs and improving reliability.

No. of Inputs: 2

Having two inputs allows for basic logic operations, making this product suitable for a wide range of digital applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V offers compatibility with standard electronic systems and ensures reliable performance.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the maximum capacitive load the product can drive effectively, ensuring signal integrity.

Power Supplies (V): 3.3/5

Support for dual power supply voltages (3.3V and 5V) enhances flexibility in circuit design and compatibility with different systems.

No. of Terminals: 14

Having 14 terminals provides ample connection points for interfacing with other components, enabling versatile circuit configurations.

Maximum I (ol): 24 Amp

The high maximum output current capability of 24A ensures the product can drive heavy loads without overheating or performance degradation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable operation even in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold in terminal finishing provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic families, making the product versatile and energy-efficient.

Maximum Power Supply Current (ICC): 0.02 mA

With a low maximum power supply current requirement, the product consumes minimal power, contributing to overall energy efficiency in electronic systems.

Technical Specifications

Logic Gates SN74AC86PWE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74AC86PWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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