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SN74ABT328DR

Texas Instruments

SN74ABT328DR by Texas Instruments

SN74ABT328DR by Texas Instruments is a clock driver with 6.1ns propagation delay at 5V, suitable for commercial applications. It features 16 terminals in a small outline package, operating b/w 0-70°C temperature range. With a max output current of 64A, it is ideal for surface mount designs requiring precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,780 parts In-Stock

1+ parts

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7,780

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Digiode

USA . 2,541 parts In-Stock

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2,541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 679 parts In-Stock

1+ parts

$8.190

100+ parts

-

1k+ parts

$7.862

10k+ parts

$7.862

679

$8.190

-

$7.862

$7.862

AZTECH Wire

Italy . 686 parts In-Stock

1+ parts

$9.756

100+ parts

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686

$9.756

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Parana Technologies

USA . 2,000 parts In-Stock

1+ parts

$11.633

100+ parts

-

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$12.029

10k+ parts

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2,000

$11.633

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$12.029

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DigiPath Technology Company

USA . 1,156 parts In-Stock

1+ parts

$12.810

100+ parts

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1,156

$12.810

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ChromeModa Solutions

Germany . 1,702 parts In-Stock

1+ parts

$13.071

100+ parts

$10.718

1k+ parts

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1,702

$13.071

$10.718

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IDEA Electronic Components Group

UK . 1,016 parts In-Stock

1+ parts

$13.071

100+ parts

$12.417

1k+ parts

$11.764

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-

1,016

$13.071

$12.417

$11.764

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One Stop Electronics

USA . 1,388 parts In-Stock

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$57.000

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1,388

$57.000

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Corphita

USA . 4,753 parts In-Stock

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4,753

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Overview

Enhance the performance of your electronic devices with the SN74ABT328DR clock driver & buffer by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge solutions for a range of applications. The SN74ABT328DR offers unmatched value and benefits, providing fast propagation delay and efficient power supplies. Whether you're looking to improve the speed and accuracy of your circuit designs or enhance the functionality of your electronic systems, this product is the perfect choice. Upgrade your technology with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver and buffer, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 6.1 ns

Low propagation delay helps in minimizing signal delays in the clock distribution network, leading to efficient and timely synchronization.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with most systems and power sources.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, making it suitable for environments where heat dissipation is a concern.

Technical Specifications

Clock Drivers & Buffers SN74ABT328DR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Maximum I (ol):

64 Amp

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6.1 ns

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74ABT328DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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