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SN74AS304DR

Texas Instruments

SN74AS304DR by Texas Instruments

SN74AS304DR by Texas Instruments is a Clock Driver with 12ns Propagation Delay, 50pF Load Capacitance, and 80MHz Min fmax. It is used in applications requiring precise clock signal distribution in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,545 parts In-Stock

1+ parts

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3,545

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Digiode

USA . 2,909 parts In-Stock

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2,909

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Distributors (Availability)

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AZTECH Wire

Italy . 547 parts In-Stock

1+ parts

$13.178

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547

$13.178

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Parana Technologies

USA . 1,043 parts In-Stock

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$28.737

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-

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$51.200

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1,043

$28.737

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$51.200

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DigiPath Technology Company

USA . 103 parts In-Stock

1+ parts

$31.643

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103

$31.643

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ChromeModa Solutions

Germany . 4,462 parts In-Stock

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$32.289

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$26.477

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4,462

$32.289

$26.477

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IDEA Electronic Components Group

UK . 1,271 parts In-Stock

1+ parts

$32.289

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$30.675

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$29.060

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1,271

$32.289

$30.675

$29.060

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One Stop Electronics

USA . 671 parts In-Stock

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$45.000

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671

$45.000

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Corphita

USA . 1,354 parts In-Stock

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Overview

Upgrade your clock systems with the SN74AS304DR by Texas Instruments, a top-quality Clock Driver & Buffer designed to enhance performance and reliability. With a fast propagation delay of 12 ns and 8 true outputs, this product is perfect for a wide range of applications. Texas Instruments is known for its cutting-edge technology and unmatched quality, ensuring that you get the best value for your investment. Trust the SN74AS304DR to deliver seamless operation and precise timing in your electronic projects. Elevate your designs with this exceptional component today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures high speed and efficiency in clock distribution.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various input signals.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Suitable for driving a moderate load capacitance, providing flexibility in system design.

Minimum Operating Temperature: 0 °C

Can operate in a wide temperature range, making it suitable for various environments.

Technology: TTL

Utilizes TTL technology known for its high speed and reliability in clock driver applications.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a slight margin above nominal supply voltage for added reliability.

Technical Specifications

Clock Drivers & Buffers SN74AS304DR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

AS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Minimum fmax:

80 MHz

Trade Compliance

SN74AS304DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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