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SN74ABT329D

Texas Instruments

SN74ABT329D by Texas Instruments

SN74ABT329D by Texas Instruments is a clock driver with 16 terminals, operating at 5V. It has a small outline package and can withstand temperatures from 0 to 70°C. Ideal for applications requiring precise clock signal distribution in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,746 parts In-Stock

1+ parts

-

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3,746

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Vyrian

USA . 2,166 parts In-Stock

1+ parts

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2,166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 809 parts In-Stock

1+ parts

$3.392

100+ parts

-

1k+ parts

$3.256

10k+ parts

$3.256

809

$3.392

-

$3.256

$3.256

Parana Technologies

USA . 1,638 parts In-Stock

1+ parts

$11.709

100+ parts

-

1k+ parts

$12.099

10k+ parts

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1,638

$11.709

-

$12.099

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DigiPath Technology Company

USA . 1,191 parts In-Stock

1+ parts

$12.893

100+ parts

$11.861

1k+ parts

-

10k+ parts

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1,191

$12.893

$11.861

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IDEA Electronic Components Group

UK . 1,561 parts In-Stock

1+ parts

$13.156

100+ parts

$12.498

1k+ parts

$11.840

10k+ parts

-

1,561

$13.156

$12.498

$11.840

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ChromeModa Solutions

Germany . 1,168 parts In-Stock

1+ parts

$13.156

100+ parts

$10.788

1k+ parts

-

10k+ parts

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1,168

$13.156

$10.788

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AZTECH Wire

Italy . 753 parts In-Stock

1+ parts

$18.853

100+ parts

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753

$18.853

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One Stop Electronics

USA . 1,470 parts In-Stock

1+ parts

$52.000

100+ parts

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1,470

$52.000

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Corphita

USA . 2,522 parts In-Stock

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2,522

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Overview

Unlock the power of precision with the SN74ABT329D clock driver and buffer by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers solutions that exceed expectations. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers. Whether you're looking to enhance the performance of your electronics or streamline your operations, the SN74ABT329D is the perfect choice. Trust in Texas Instruments to elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the clock driver or buffer.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying production processes.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage of 5V, making it compatible with a wide range of electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this clock driver or buffer can withstand moderate heat levels without compromising performance.

Technical Specifications

Clock Drivers & Buffers SN74ABT329D attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.15

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74ABT329D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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