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SN74AS303DR

Texas Instruments

SN74AS303DR by Texas Instruments

SN74AS303DR by Texas Instruments is a Clock Driver & Buffer with 16 terminals, TTL technology, and 9 ns propagation delay. It operates at a supply voltage range of 4.5V to 5.5V and has a load capacitance of 50 pF. Ideal for applications requiring precise clock signal distribution in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,707 parts In-Stock

1+ parts

-

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7,707

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Digiode

USA . 4,662 parts In-Stock

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4,662

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,032 parts In-Stock

1+ parts

$2.912

100+ parts

-

1k+ parts

$2.795

10k+ parts

$2.795

1,032

$2.912

-

$2.795

$2.795

One Stop Electronics

USA . 1,278 parts In-Stock

1+ parts

$12.000

100+ parts

-

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1,278

$12.000

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Parana Technologies

USA . 587 parts In-Stock

1+ parts

$14.665

100+ parts

-

1k+ parts

$15.105

10k+ parts

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587

$14.665

-

$15.105

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AZTECH Wire

Italy . 708 parts In-Stock

1+ parts

$15.247

100+ parts

-

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708

$15.247

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DigiPath Technology Company

USA . 2,096 parts In-Stock

1+ parts

$16.147

100+ parts

$14.856

1k+ parts

-

10k+ parts

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2,096

$16.147

$14.856

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ChromeModa Solutions

Germany . 4,371 parts In-Stock

1+ parts

$16.477

100+ parts

$13.511

1k+ parts

-

10k+ parts

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4,371

$16.477

$13.511

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IDEA Electronic Components Group

UK . 1,012 parts In-Stock

1+ parts

$16.477

100+ parts

$15.653

1k+ parts

$14.829

10k+ parts

-

1,012

$16.477

$15.653

$14.829

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Corphita

USA . 3,618 parts In-Stock

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3,618

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Overview

Enhance your electronic designs with the SN74AS303DR by Texas Instruments, a top-quality Clock Driver & Buffer that delivers exceptional performance and reliability. Designed with precision and expertise, this product boasts a range of applications in various industries. With a focus on value and efficiency, customers can expect seamless integration, improved functionality, and enhanced overall performance. Trust Texas Instruments to provide cutting-edge solutions that meet your needs and exceed expectations. Elevate your projects with the SN74AS303DR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to damage during handling and installation.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto PCBs.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage ensures compatibility with common power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception.

Propagation Delay (tpd): 9 ns

Low propagation delay ensures fast and accurate signal processing.

Maximum Operating Temperature: 70 °C

Suitable operating temperature range for reliable performance in various environments.

Technology: TTL

TTL technology offers high speed and low power consumption for efficient operation.

Minimum fmax: 80 MHz

High maximum frequency for fast data processing and communication.

Technical Specifications

Clock Drivers & Buffers SN74AS303DR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

AS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

2

No. of Terminals:

16

No. of True Outputs:

6

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

2 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

80 MHz

Trade Compliance

SN74AS303DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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