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SN74120J

Texas Instruments

SN74120J by Texas Instruments

SN74120J by Texas Instruments is a TTL clock driver with 16 terminals, operating at 5V. It has a rectangular ceramic package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring precise clock signal distribution in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,899 parts In-Stock

1+ parts

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5,899

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Digiode

USA . 511 parts In-Stock

1+ parts

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511

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Lakeland Logistics Inc

USA . 7 parts In-Stock

1+ parts

-

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7

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Bristol Electronics

USA . 7 parts In-Stock

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7

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MISTER SPROCKETS

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,049 parts In-Stock

1+ parts

$1.256

100+ parts

-

1k+ parts

$1.206

10k+ parts

$1.206

1,049

$1.256

-

$1.206

$1.206

Parana Technologies

USA . 18 parts In-Stock

1+ parts

$9.852

100+ parts

$914.936

1k+ parts

$8.867

10k+ parts

-

18

$9.852

$914.936

$8.867

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$10.321

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431

$10.321

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DigiPath Technology Company

USA . 2,026 parts In-Stock

1+ parts

$10.849

100+ parts

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2,026

$10.849

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ChromeModa Solutions

Germany . 2,482 parts In-Stock

1+ parts

$11.070

100+ parts

$9.077

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-

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2,482

$11.070

$9.077

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IDEA Electronic Components Group

UK . 229 parts In-Stock

1+ parts

$11.070

100+ parts

$10.516

1k+ parts

$9.963

10k+ parts

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229

$11.070

$10.516

$9.963

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One Stop Electronics

USA . 266 parts In-Stock

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$40.000

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266

$40.000

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Corphita

USA . 1,592 parts In-Stock

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1,592

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Overview

Elevate your electronics projects with the SN74120J Clock Driver & Buffer by Texas Instruments. Known for their superior quality and expertise in semiconductor manufacturing, Texas Instruments delivers a reliable and efficient solution for clock signal distribution. Perfect for a wide range of applications, this product offers precise timing control and seamless integration, ensuring optimal performance. Trust in Texas Instruments to provide you with the tools you need to bring your designs to life. Experience the value and benefits of the SN74120J today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material for electronic components, providing better thermal conductivity and resistance to shock and vibration.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes this product compatible with a wide range of systems and circuits.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this clock driver & buffer can function in various environmental conditions.

Technology: TTL

Utilizing TTL (Transistor-Transistor Logic) technology ensures fast and reliable signal processing and compatibility with other TTL devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies installation and soldering, making it easier to incorporate this clock driver & buffer into electronic assemblies.

Technical Specifications

Clock Drivers & Buffers SN74120J attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74120J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-615-3922, 5962006153922

NIIN

006153922

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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