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SN74ABT337DW

Texas Instruments

SN74ABT337DW by Texas Instruments

SN74ABT337DW by Texas Instruments is a Clock Driver & Buffer with 20 terminals, operating at 5V. It features 8 true outputs, 3-STATE output characteristics, and a max frequency of 80MHz. Ideal for applications requiring standard input conditioning and a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,891 parts In-Stock

1+ parts

-

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1k+ parts

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3,891

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Vyrian

USA . 3,299 parts In-Stock

1+ parts

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1k+ parts

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3,299

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$4.888

100+ parts

-

1k+ parts

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410

$4.888

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Parana Technologies

USA . 2,167 parts In-Stock

1+ parts

$19.905

100+ parts

-

1k+ parts

$19.858

10k+ parts

-

2,167

$19.905

-

$19.858

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DigiPath Technology Company

USA . 64 parts In-Stock

1+ parts

$21.918

100+ parts

-

1k+ parts

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64

$21.918

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ChromeModa Solutions

Germany . 2,216 parts In-Stock

1+ parts

$22.365

100+ parts

$18.339

1k+ parts

-

10k+ parts

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2,216

$22.365

$18.339

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$22.365

100+ parts

$21.247

1k+ parts

$20.128

10k+ parts

-

266

$22.365

$21.247

$20.128

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One Stop Electronics

USA . 919 parts In-Stock

1+ parts

$55.000

100+ parts

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919

$55.000

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Corphita

USA . 236 parts In-Stock

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236

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Overview

Enhance your electronic designs with the SN74ABT337DW by Texas Instruments. Crafted with precision and quality, this clock driver and buffer is a reliable choice for various applications. With a 3-STATE output characteristic and a maximum frequency of 80 MHz, this product offers high performance and efficiency. Trust in Texas Instruments' expertise in manufacturing to deliver top-notch products that meet your needs. Upgrade your projects today with the SN74ABT337DW and experience the benefits of superior technology at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time during assembly.

Nominal Supply Voltage / Vsup (V): 5

Optimal supply voltage for stable and efficient operation of the product.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signals, contributing to versatile applications.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions, suitable for various environments.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Clock Drivers & Buffers SN74ABT337DW attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

ABT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Minimum fmax:

80 MHz

Trade Compliance

SN74ABT337DW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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