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SN74ABT16600DLG4

Texas Instruments

SN74ABT16600DLG4 by Texas Instruments

SN74ABT16600DLG4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 4.9 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperatures (-40 to 85 °C) with independent control and negative edge trigger type, making it ideal for bidirectional data transmission applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,608 parts In-Stock

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Digiode

USA . 3,274 parts In-Stock

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3,274

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Distributors (Availability)

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Andel Nordic

Denmark . 951 parts In-Stock

1+ parts

$6.558

100+ parts

-

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$6.296

10k+ parts

$6.296

951

$6.558

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$6.296

$6.296

AZTECH Wire

Italy . 692 parts In-Stock

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$11.271

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692

$11.271

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Parana Technologies

USA . 541 parts In-Stock

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$24.011

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$24.668

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541

$24.011

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$24.668

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DigiPath Technology Company

USA . 1,337 parts In-Stock

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$26.439

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1,337

$26.439

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ChromeModa Solutions

Germany . 955 parts In-Stock

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$26.979

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$22.123

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955

$26.979

$22.123

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IDEA Electronic Components Group

UK . 779 parts In-Stock

1+ parts

$26.979

100+ parts

$25.630

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$24.281

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779

$26.979

$25.630

$24.281

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One Stop Electronics

USA . 1,421 parts In-Stock

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$35.000

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Corphita

USA . 3,438 parts In-Stock

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3,438

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Microchip USA

USA . 280 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the SN74ABT16600DLG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in their Bus Driver & Transceivers. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. Experience lightning-fast speeds and efficient performance without compromising on quality. Upgrade your systems today with the SN74ABT16600DLG4 and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration into various electronic designs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and power sources.

Maximum I (ol): 64 Amp

High maximum output current of 64 Amp allows for driving heavy loads without the need for additional driver circuitry.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable operation in harsh environments or extreme conditions.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, resulting in improved performance and efficiency.

Technical Specifications

Bus Driver & Transceivers SN74ABT16600DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Maximum I (ol):

64 Amp

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

NEGATIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74ABT16600DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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