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SN65LVCP40RGZR

Texas Instruments

SN65LVCP40RGZR by Texas Instruments

SN65LVCP40RGZR by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage and 4000 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has a compact square chip carrier package suitable for telecom circuit applications.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 5,620 parts In-Stock

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Vyrian

USA . 2,032 parts In-Stock

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Digiode

USA . 422 parts In-Stock

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ComSIT Distribution GmbH

Germany . 49 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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AZTECH Wire

Italy . 538 parts In-Stock

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$8.588

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Parana Technologies

USA . 904 parts In-Stock

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$15.030

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$1,395.793

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$13.527

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DigiPath Technology Company

USA . 1,839 parts In-Stock

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$16.550

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ChromeModa Solutions

Germany . 2,382 parts In-Stock

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IDEA Electronic Components Group

UK . 674 parts In-Stock

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Microchip USA

USA . 1,876 parts In-Stock

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One Stop Electronics

USA . 1,367 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,445 parts In-Stock

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Kepictronics

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Corphita

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Overview

Unlock a world of seamless communication with the SN65LVCP40RGZR by Texas Instruments. Known for their top-notch quality and innovative solutions, Texas Instruments delivers excellence in every product they create. The SN65LVCP40RGZR is a game-changer in the category of Other Function Telecom Interface ICs, offering unmatched reliability and performance. From its advanced features to its efficient design, this product provides exceptional value to customers looking for superior telecommunications solutions. Elevate your communication systems with the SN65LVCP40RGZR and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with a wide range of systems and reduces the need for additional voltage conversion components.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and functionality, making the product suitable for complex telecom applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable operation in harsh environments, making the product suitable for industrial applications.

Data Rate: 4000 Mbps

Supporting a high data rate of 4000 Mbps enables fast and efficient data transmission, making the product ideal for high-speed telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs SN65LVCP40RGZR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4000 Mbps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.254 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

SN65LVCP40RGZR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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