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PCI2050IPDV

Texas Instruments

PCI2050IPDV by Texas Instruments

PCI2050IPDV by Texas Instruments is a Bus Controller with 32-bit Address and External Data Bus Width. It operates at 3-3.6V, supports PCI bus compatibility, and has a max clock frequency of 33MHz. Ideal for industrial applications requiring high-speed data processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,660 parts In-Stock

1+ parts

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3,660

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Digiode

USA . 2,409 parts In-Stock

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2,409

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LWI Electronics Inc

India . 4 parts In-Stock

1+ parts

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4

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Sogenti Electronics

Canada . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 406 parts In-Stock

1+ parts

$17.628

100+ parts

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406

$17.628

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One Stop Electronics

USA . 1,314 parts In-Stock

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$25.000

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1,314

$25.000

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Parana Technologies

USA . 1,985 parts In-Stock

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$59.860

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1,985

$59.860

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IDEA Electronic Components Group

UK . 238 parts In-Stock

1+ parts

$67.258

100+ parts

$63.895

1k+ parts

$60.532

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238

$67.258

$63.895

$60.532

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ChromeModa Solutions

Germany . 169 parts In-Stock

1+ parts

$67.258

100+ parts

$55.152

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169

$67.258

$55.152

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Corohmni

South Africa . 5,235 parts In-Stock

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$71.801

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5,235

$71.801

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Corphita

USA . 4,376 parts In-Stock

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4,376

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DigiPath Technology Company

USA . 2,001 parts In-Stock

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$60.640

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2,001

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$60.640

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Microchip USA

USA . 120 parts In-Stock

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120

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Overview

Unlock seamless data transfer and enhanced performance with the PCI2050IPDV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that are reliable and efficient. Ideal for a wide range of applications, this product offers unparalleled value to customers seeking high-speed connectivity and optimal functionality. Experience the benefits of cutting-edge technology with the PCI2050IPDV and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and enabling efficient assembly.

Maximum Supply Voltage: 3.6 V

Can handle high voltage inputs, making it versatile for different power supply configurations.

Address Bus Width: 32

Supports a wide range of memory addressing capabilities, enabling efficient data transfer and processing.

Package Shape: SQUARE

Optimizes space utilization on the PCB, ensuring efficient layout and design.

Power Supplies (V): 3.3,3.3/5

Allows for flexibility in power input options, accommodating various system requirements.

No. of Terminals: 208

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and low-profile design, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Ensures compatibility with lower voltage power sources, enhancing system integration capabilities.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extreme cold conditions, expanding the range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections for long-term use.

Terminal Position: QUAD

Facilitates easy and secure mounting on the PCB, enhancing reliability and stability.

Maximum Seated Height: 1.45 mm

Allows for a low-profile design, reducing the overall height of the system.

Width: 28 mm

Compact width dimension enables space-efficient placement on the PCB.

External Data Bus Width: 32

Matches the address bus width for efficient data transfer and processing capabilities.

Maximum Clock Frequency: 33 MHz

Supports high-speed data processing, enhancing system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for a sufficient period, ensuring proper soldering and reliable connections.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the solder reflow process, ensuring robust assembly.

Length: 28 mm

Compact length dimension facilitates space-efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring consistent performance in demanding environments.

Peripheral IC Type: BUS CONTROLLER, PCI

Specialized for bus control functions, specifically for PCI bus systems, ensuring compatibility and optimized performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: GULL WING

Facilitates easy soldering and secure PCB mounting, ensuring reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Standard voltage supply for stable operation and compatibility with common power sources.

Bus Compatibility: PCI

Designed specifically for PCI bus systems, ensuring seamless integration and optimized performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, maximizing PCB space utilization.

Technical Specifications

Bus Controllers PCI2050IPDV attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e4

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

PCI2050IPDV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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